Temperature-dependent nanoindentation response of materials

Chavoshi, Saeed Zare; Xu, Shuozhi

doi:10.1557/mrc.2018.19

Cited by 22 publications

(4 citation statements)

References 108 publications

(124 reference statements)

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“…This linear decline differs from the behavior observed in our previous study on Ag9In4, where the hardness remained nearly constant from 30 °C to 125 °C before exhibiting an exponential decrease up to 250 °C [26]. The hardness obtained from the nanoindentation tests is primarily associated with dislocation movement [30], which is influenced by thermally activated vacancies [29]. Based on the phase diagram shown in Figure 3, the melting point of the ζ (Ag3In) phase is approximately 660 °C, whereas gamma-Ag9In4 undergoes a solid-state reaction to the ζ (Ag3In) phase at around 300 °C.…”

Section: Characterization Of Bulk ζ (Ag 3 In) Samplescontrasting

confidence: 82%

Thermomechanical Properties of Zeta (Ag3In) Phase

Liu,

Tatsumi,

Jin

et al. 2023

Materials

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The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young’s modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs.

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Section: Characterization Of Bulk ζ (Ag 3 In) Samplescontrasting

confidence: 82%

Thermomechanical Properties of Zeta (Ag3In) Phase

Liu,

Tatsumi,

Jin

et al. 2023

Materials

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“…The ultimate goal of developing and applying atomistic/continuum coupling approaches is to combine atomic-level accuracy with macroscale efficiency in solving material problems in engineering. By complementing nano/microscale experiments [207,208], these state-of-the-art multiscale materials modelling methods have the potential to provide enhanced reliability in linking processing, structure, property, and performance on the length and time scales necessary for discovery, design, development, and deployment of novel materials for the future. Key tasks ahead involve both methodologies and applications, which should progress hand in hand.…”

Section: Challenges and Perspectivesmentioning

confidence: 99%

Modeling dislocations and heat conduction in crystalline materials: atomistic/continuum coupling approaches

Chen

2018

International Materials Reviews

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Dislocations and heat conduction are essential components that influence properties and performance of crystalline materials, yet the modelling of which remains challenging partly due to their multiscale nature that necessitates simultaneously resolving the short-range dislocation core, the long-range dislocation elastic field, and the transport of heat carriers such as phonons with a wide range of characteristic length scale. In this context, multiscale materials modelling based on atomistic/continuum coupling has attracted increased attention within the materials science community. In this paper, we review key characteristics of five representative atomistic/continuum coupling approaches, including the atomistic-to-continuum method, the bridging domain method, the concurrent atomistic-continuum method, the coupled atomistic/discrete-dislocation method, and the quasicontinuum method, as well as their applications to dislocations, heat conduction, and dislocation/phonon interactions in crystalline materials. Through problem-centric comparisons, we shed light on the advantages and limitations of each method, as well as the path towards enabling them to effectively model various material problems in engineering from nano-to mesoscale.

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“…Dislocations are the main carriers of plasticity in metals [1]. To examine dislocations in motion, scientists have developed several in situ experimental methods [2,3], such as transmission electron microscopy [4] and x-ray topographic characterization [5]. Through these experimental techniques, the movement of dislocations can be observed directly or characterized indirectly.…”

Section: Introductionmentioning

confidence: 99%

Atomistic simulations of dynamics of an edge dislocation and its interaction with a void in copper: a comparative study

Jian

Zhang

et al. 2020

Modelling Simul. Mater. Sci. Eng.

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Atomistic simulation methods are appropriate tools for investigating the dynamics of dislocations and their interactions with obstacles in metallic materials. In particular, molecular dynamics (MD) simulations have been widely employed on these two topics in the past several decades. However, even for the same type of simulation, the results can vary. While some of the quantitative differences may be due to the choices of interatomic potential and simulation cell size, they could similarly be attributed to choice of model settings, which have also differed substantially to date. In this paper, we carry out systematic MD simulations to study the effects of a few key model settings on the dynamics of an edge dislocation and its interaction with a void in copper. For a fixed interatomic potential, three modeling parameters, including applied loading mode, boundary conditions, and thermostat, are considered and their influences on the stress–strain response, the dislocation velocity, and the critical stress for a dislocation to bypass a void are compared. For a few select cases, we further examine the influence of temperature, strain rate, and simulation cell size. The results show that (i) compared with flexible boundary conditions, rigid boundary conditions result in greater stress oscillations in simulation cells of certain sizes; (ii) compared with the cases of no thermostat and a full thermostat, a partial thermostat provides better temperature control and lower friction on the dislocation core, respectively; and (iii) for dislocation–void interactions, the critical dislocation bypassing stress in shear loading can be appropriately determined with either a constant applied strain rate or a constant applied stress although the strain rate cannot be controlled in the latter. This analysis reveals that these three settings greatly influence the accuracy and interpretation of the results for the same type of simulation.

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Temperature-dependent nanoindentation response of materials

Abstract: Abstract

Cited by 22 publications

References 108 publications

Thermomechanical Properties of Zeta (Ag3In) Phase

Thermomechanical Properties of Zeta (Ag3In) Phase

Modeling dislocations and heat conduction in crystalline materials: atomistic/continuum coupling approaches

Atomistic simulations of dynamics of an edge dislocation and its interaction with a void in copper: a comparative study

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