Temperature Effect on Non-Vacuum Solid State Diffusion Bonded Joints of Al 2014

Abstract

Diffusion bonding is a joining process that relies on the inter-diffusion of atoms across the interface as the primary mechanism. Diffusion bonding techniques such as solid state and transient liquid phase (TLP) bonding are currently performed in a vacuum, which is a time-consuming, costly method and also limits the size of the components that can be bonded adequately. The present study aims at achieving the diffusion bonded joints of AA2014 under the bonding temperatures of 440, 460, and 480 0C. Microstructural evaluation is carried out using light optical microscopy (LOM), and scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) is used for elemental analysis on the interface of the bonded specimens. Hardness at the interface is evaluated using the Vickers Microhardness test.