Temperature influence on the interlayer and surface morphology of diamond coating on 3D porous titanium substrates

Braga, N.A.; Cairo, Carlos Alberto Alves; Almeida, E.C.; Baldan, Maurício Ribeiro; Ferreira, N.G.

doi:10.1016/j.diamond.2009.01.043

Cited by 18 publications

(7 citation statements)

References 35 publications

(39 reference statements)

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“…MC pre‐treatment thus creates a Co‐deficient, loose, granular layer on the substrate surface suitable for subsequent diamond nucleation and growth 16, 27. As such, these substrates show some parallels with the studies of Braga et al 3–6 wherein hybrid three‐dimensional (3‐D) electrodes were formed by growing (by HFCVD) microcrystalline boron‐doped diamond and/or nanocrystalline diamond films on porous Ti substrates.…”

Section: Resultsmentioning

confidence: 59%

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Fabrication of adherent porous diamond films on sintered WC‐13 wt.%Co substrates by bias enhanced hot filament chemical vapour deposition

Wei

Ashfold

et al. 2011

Physica Status Solidi (a)

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Porous diamond (PD) films have been grown on sintered WC‐13 wt.%Co substrates by bias enhanced hot filament (HF) chemical vapour deposition (CVD) methods and characterized by scanning electron microscopy (SEM), laser Raman spectroscopy and X‐ray diffraction (XRD). The PD films show excellent adhesion under Rockwell indentation testing. Factors encouraging the growth of diamond film with high porosity are discussed.

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Section: Resultsmentioning

confidence: 59%

“…1, 2. Porous diamond (PD) films have received much recent attention 3–12. The high surface area and multifaceted morphology of PD films increases their capacity for electron field emission, and the aspect ratios of the emission sites 9.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of adherent porous diamond films on sintered WC‐13 wt.%Co substrates by bias enhanced hot filament chemical vapour deposition

Wei

Ashfold

et al. 2011

Physica Status Solidi (a)

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“…The first concerns the difference of the thermal expansion coefficients between Ti and diamond. The second may be related to the formation of intermediate phases such as hydrides and titanium carbides, which depend on the substrate pre-treatment, the carbon source content on the gas phase, and the substrate temperature [14]. The BDD morphology is associated to the microcrystalline grains randomly oriented.…”

Section: Sem Analysesmentioning

confidence: 99%

"Surface Roughness and Seeding Process Influence on Boron Doped Micro/Nanocrystalline Diamond Adhesion on Titanium Substrate"

Oishi

2018

TTEFT

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Besides the seeding process, the substrate roughness also represents a significant contribution on diamond film adhesion that can be favorable on its anchorage course. Mallik et al. [11] have discussed the substrate roughness influence on diamond growth on Abstract CVD (Chemical Vapor Deposition) diamond deposition on different materials requires surface treatment such as diamond particles seeding on the substrate dispersed in an appropriate solvent by using ultrasonic agitation. On the other hand, seeding process by electrostatic attraction of nanodiamond particle have produced films with higher nucleation density compared to that obtained from ultrasonic treatment. In addition, nucleation and growth of micro/nanocrystalline boron doped diamond films (BDD/NBDD) on titanium (Ti) substrates represent a complex process, mainly due to the poor film adhesion related to the difference in the thermal expansion coefficients between the film and the substrate. Thus, the substrate morphology associated to the seeding process can be determinant for this adhesion. In this context, the adhesion of BDD and NBDD films on Ti substrate was systematically considered in five different Ti surface roughness associated to two different seeding processes: ultrasonic agitation with 0.25μm diamond particle and electrostatic seeding with 4nm diamond particle in potassium chloride. Thus, twenty different diamond film sample sets were grown by CVD technique following the combinations of BDD and NBDD morphologies, Ti roughnesses, and seeding methodologies. The samples were characterized by scanning electron microscopy, Raman scattering spectroscopy, and X-ray diffraction (XRD). The adhesion tests were performed by the Rockweel hardness test according to VDI 3198. The results showed that the BDD and NBDD films grown with electrostatic seeding with 4nm diamond particle presented the best adhesion regardless of substrate roughness while only the Ti substrates with higher roughness presented good adhesion for ultrasonic agitation pre-treatment with 0.25μm diamond particle. These results indicate that the electrostatic seeding pre-treatment associated with greater surface roughness have an important role in improving diamond films adhesion for the two studied morphologies.

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“…Deposition technologies of CVD diamond films on these substrates have been widely studied in the previous studies. [5][6][7][8][9] The adhesion between the diamond film and substrate plays a momentous role in the performance of diamond-coated components. Many pretreatment and deposition methods have been proposed to improve the adhesion of diamond films, such as mechanical lapping, chemical etching, oxidation, and interlayer.…”

Section: Introductionmentioning

confidence: 99%

“…Deposition technologies of CVD diamond films on these substrates have been widely studied in the previous studies. 5–9…”

Section: Introductionmentioning

confidence: 99%

Erosive wear performance of boron-doped diamond films on different substrates

Wang

Cui

Zhang

et al. 2013

Proceedings of the Institution of Mechanical Engineers, Part J:

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Diamond films have been considered as good candidate protective coatings on varieties of substrates in order to improve their erosive wear performance. In the present study, boron-doped diamond films with thicknesses of about 6-7 mm are first deposited on five different substrates using the hot filament chemical vapor deposition method, including SiC, WC-Co, Ta, Ti, and Si substrates. The residual stress and adhesive strength of the five boron-doped diamond films are estimated, respectively, by means of material properties of substrates and the diamond, Raman spectra, and static indentation results. Erosion tests are conducted on all the boron-doped diamond coated samples in an air-sand erosion rig with angular SiC sands as erodents. The results exhibit that the formation of ring cracks on the boron-doped diamond film in the erosion process has a strong link to the total residual stress. The higher residual compressive stress in the Ti-based boron-doped diamond film can slow down the formation of ring cracks to some extent. Nevertheless, the erosive wear performance, which is mainly evaluated based on the erosion rate and film removal, is much related to the filmsubstrate adhesion. As a result, the Ti-based boron-doped diamond film is quickly worn and removed because of the poorest adhesion. On the contrary, both the SiC-and Si-based boron-doped diamond films with favorable adhesion perform much better erosion resistance. Moreover, comparative erosion tests on thicker SiC-and WC-Co-based boron-doped diamond films (21-23 mm) and their applications on nozzles can both further manifest the same kind of relationship, the SiC-based boron-doped diamond film presenting longer steady erosive stage and slower film removal than the WC-Co-based one.

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Temperature influence on the interlayer and surface morphology of diamond coating on 3D porous titanium substrates

Cited by 18 publications

References 35 publications

Fabrication of adherent porous diamond films on sintered WC‐13 wt.%Co substrates by bias enhanced hot filament chemical vapour deposition

Fabrication of adherent porous diamond films on sintered WC‐13 wt.%Co substrates by bias enhanced hot filament chemical vapour deposition

"Surface Roughness and Seeding Process Influence on Boron Doped Micro/Nanocrystalline Diamond Adhesion on Titanium Substrate"

Erosive wear performance of boron-doped diamond films on different substrates

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