Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

Yan, Qi; Lam, Rex; Ghorbani, Hamid Reza; Snugovsky, Polina; Spelt, J.K.

doi:10.1016/j.microrel.2005.01.008

Cited by 56 publications

(29 citation statements)

References 9 publications

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“…Both the FE and the present model suggest that the driving force for the failure of the solder joint is greater at the upper solder interface regardless of whether the stress state is plane stress or plain strain. This is consistent with the experimental observation of Qi et al [7] who reported that cracks usually initiated at the inside free end of the LCR solder layer and propagated outward into the fillet. It might be anticipated that the crack propagation time would be relatively short [7] due to the fairly constant magnitude of the von Mises stress along this interface.…”

Section: Resultssupporting

confidence: 93%

Interfacial thermal stresses in solder joints of leadless chip resistors

Ghorbani

Spelt

2006

Microelectronics Reliability

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Section: Resultssupporting

confidence: 93%

Interfacial thermal stresses in solder joints of leadless chip resistors

Ghorbani

Spelt

2006

Microelectronics Reliability

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“…This corresponds with the aforementioned effect of the component packages and thermal cycling conditions on the thermomechanical creep/ fatigue properties of lead-free SnAgCu solders. [8][9][10][11] Similarly to the modules tested in harsh test conditions, three modules of the test board were carefully detached from the PWB. A typical fracture surface on the LTCC side of the joint after the TCT over a temperature range of 0°C-100°C is presented in Fig.…”

Section: Failure Mechanisms In the 0-100°c Thermal Cycling Testmentioning

confidence: 99%

“…As mentioned earlier, this transition of thermal creep/ fatigue endurance between SnPb and SAC solder has been recognized in the literature. [8][9][10][11] However, the situation is rather complex in the case of SAC/ PCSB composite solder joints, and an estimate of the feasibility of the present test configuration in different thermal conditions should not be based only on the results of the thermal cycling tests.…”

Section: Thermal Cycling Testsmentioning

confidence: 99%

“…4 On the other hand, depending on the component packages and thermal cycling conditions, thermomechanical creep/fatigue properties of lead-free SnAgCu (SAC) solders vary compared with the SnPb solder materials. [8][9][10][11] So, using the PCSBs in composite solder joint configurations is expected to improve the thermomechanical reliability of a leadfree LTCC/PWB assembly, whereas the use of SAC may have an adverse effect in harsh test conditions.…”

Section: Introductionmentioning

confidence: 99%

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Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies

Nousiainen

Putaala

Kangasvieri

et al. 2007

Journal of Elec Materi

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The thermal fatigue endurance of completely lead-free 95.5Sn4Ag0.7Cu/ plastic core solder ball (PCSB) composite joint structures in low-temperature Co-fired ceramic/printed wiring board (LTCC/PWB) assemblies was investigated using thermal cycling tests over the temperature ranges of )40°C-125°C and 0°C-100°C. Two separate creep/fatigue failures initiated and propagated in the joints during the tests: (1) a crack along the intermetallic compound (IMC)/solder interface on the LTCC side of the joint, which formed at the high-temperature extremes; and (2) a crack in the solder near the LTCC solder land, which formed at the low-temperature extremes. Moreover, localized recrystallization was detected at the outer edge of the joints that were tested in the harsh ()40°C-125°C) test conditions. The failure mechanism was creep/fatigue-induced mixed intergranular and transgranular cracking in the recrystallized zone, but it was dominated by transgranular thermal fatigue failure beyond the recrystallized zone. The change in the failure mechanism increased the rate of crack growth. When the lower temperature extreme was raised from )40°C to 0°C, no recrystallized zone was detected and the failure was due to intergranular cracks.

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“…Humfeld and Dillard, 1998), and creep-fatigue damage in structures with viscoelastic or viscoplastic materials (e.g. Qi et al, 2006). 0020-7683/$ -see front matter Ó 2006 Elsevier Ltd. All rights reserved.…”

Section: Introductionmentioning

confidence: 99%

Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies

Ghorbani

Spelt

2006

International Journal of Solids and Structures

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A two-dimensional model has been developed for thermal stresses, elastic strains, creep strains, and creep energy density at the interfaces of short and long trilayer assemblies under both plane stress and plane strain conditions. Both linear (viscous) and non-linear creep constitutive behavior under static and cyclic thermal loading can be modeled for all layers. Interfacial stresses and strains are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Partial differential equations are linearized through a simple finite difference discretization procedure. The approach is mathematically straightforward and can be extended to include plastic behavior and problems involving external loads and a variety of geometries. The model can provide input data for thermal fatigue life prediction in solder or adhesive joints. For a typical solder joint, it is demonstrated that the predicted cyclic stress-strain hysteresis shows shakedown and a rapid stabilization of the creep energy dissipation per cycle in agreement with the predictions of finite element analysis.

show abstract

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

Cited by 56 publications

References 9 publications

Interfacial thermal stresses in solder joints of leadless chip resistors

Interfacial thermal stresses in solder joints of leadless chip resistors

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies

Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies

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