Temperature pulse voltammetry: hot layer electrodes made by LTCC technology

Electrochemical and thermodynamic properties of hexacyanoferrate(II)/(III) redox system on multi-walled carbon nanotubes

“…The results indicate that the equilibrium of the redox process [Fe(CN) 6 6 ] 4À [28]. As it can be seen in figure 2, the variation of E 1/2 with the temperature is linear (correlation coefficient 0.9998) within the experimental temperature range of (278.15 to 303.15) K [29,30]. The temperature coefficient of dE 1/2 /dT = À1.60 mV Á K À1 determined for [Fe(CN) 6 ] 3À/4À on both MWCNT-based films is in absolute agreement with the published values of dE 1/2 /dT = À1.60 mV Á K À1 [31] and dE 1/2 /dT = À1.56 mV Á K À1 [32], obtained for the same redox system on platinum electrode.…”

Screen‐printed gold thick films for electrochemical sensor applications

“…Screen-printed thick film electrodes were prepared from two commercially available pastes DP5742 (Dupont), ESL8837G (Electro Science Labs) and from our in-house development (IKTS) with a size of 0.173 cm 2 . After printing, the electrodes were co-fired on a ceramic LTCC substrate DP951GT (Dupont) at a sintering temperature of 850 8C in atmosphere.…”

“…Possible applications are the mass production of cheap sensors or the fabrication of parallel miniaturized electrode arrays, which could be used for fast electrochemical analysis and screening for example in biochemistry, pharmacology and environmental science. There are reports on screen printed gold electrodes [2][3][4][5][6] but a comparative study of the influence of different screen-printing pastes on the microstructure of the sintered thick film electrodes and their electrochemical behaviour is lacking.…”

Biparametric Potentiometric Analytical Microsystem Based on the Green Tape Technology

“…Pretreatment stages [1][2][3], different types of detection systems [4][5][6][7], actuators or measurement and data acquisition systems [8,9] can be easily integrated in a substrate through the fabrication of three-dimensional geometries by means of a multilayer approach. The technique was firstly conceived to develop compact and miniaturized electronic devices because of the symbiotic assembling of fluidics and electronics [10,11].…”