2020
DOI: 10.1039/d0tc00326c
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Temperature stable Li2Ti0.75(Mg1/3Nb2/3)0.25O3-based microwave dielectric ceramics with low sintering temperature and ultra-low dielectric loss for dielectric resonator antenna applications

Abstract: The LTMN0.25 + 1 wt% 0.6CuO–0.4B2O3 ceramic with low sintering temperature, small density and excellent performance have wide application prospects in 5G devices.

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Cited by 162 publications
(49 citation statements)
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“…In addition, the sintering temperature of MgO-2B2O3 ceramics is still too high for LTCC devices [15]. Sintering additives [16][17][18][19][20][21][22][23][24][25][26], ultrafine powders [27][28][29][30][31], and low sintering temperatures materials [32][33][34] can be used to reduce the sintering temperature of ceramics. However, the preparation of ultrafine powder with low intrinsic sintering temperatures is expensive, complex and hard to be scaled up.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the sintering temperature of MgO-2B2O3 ceramics is still too high for LTCC devices [15]. Sintering additives [16][17][18][19][20][21][22][23][24][25][26], ultrafine powders [27][28][29][30][31], and low sintering temperatures materials [32][33][34] can be used to reduce the sintering temperature of ceramics. However, the preparation of ultrafine powder with low intrinsic sintering temperatures is expensive, complex and hard to be scaled up.…”
Section: Introductionmentioning
confidence: 99%
“…In order to meet the requirement of 5 G communications, microwave dielectric ceramics with low permittivity (ε r ) and high-quality factor (Q × f) is one of the research emphases, since low ε r can provide high-speed signal transmission and high Q × f usually ensure good frequency selectivity. Additionally, these ceramics should possess a nearzero temperature coefficient of resonant frequency (τ f ) for satisfactory thermal stability [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
“…[ 1–4 ] In addition, with the rapid development of electronic industry and forthcoming large‐scale application of the fifth generation wireless systems, the signal delay and energy loss heating have become urgent problems to be solved. Under high frequency, demanding requirements, such as ultralow dielectric constant and dielectric loss, [ 5–8 ] are put forward for the epoxy resin commonly used in packaging.…”
Section: Introductionmentioning
confidence: 99%