Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

Kobayashi, Kyosuke; Shohji, Ikuo; Hokazono, Hiroaki

doi:10.4028/www.scientific.net/msf.879.2377

Cited by 11 publications

(10 citation statements)

References 10 publications

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“…For the solder alloy used in this product, a combination of high heat durability, good tensile properties and high fatigue resistance is required. 8,9) SnSb alloys, which are lead-free high-temperature solders, are possible alternatives to Pb-rich solders. It has been reported that Sn5Sb (mass%) has good electric resistivity, high fracture strength and excellent fatigue resistance.…”

Section: Introductionmentioning

confidence: 99%

“…It has been reported that Sn5Sb (mass%) has good electric resistivity, high fracture strength and excellent fatigue resistance. 9,10) It has also been reported that the addition of microelements has the potential to enhance the mechanical properties of Sn-based solders. Many researchers have studied the effects of Au, Ag or Cu in SnSb solder on various properties.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties

2019

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The purpose of the present study is to investigate the melting properties, microstructures, tensile properties and fatigue properties of Sn 5Sb(0.050.50)Ni (mass%) high-temperature lead-free solders. The solidus temperature and liquidus temperature of the Sn5SbNi solders are approximately equal to those of the Sn5Sb alloy. From the result of EPMA mapping analysis and the SnSbNi ternary phase diagram, the Sn 5SbNi solders are found to consist of ¢-Sn, SbSn and NiSb phases. As the amount of Ni in the Sn5SbNi solder increases, the number of NiSb phases increases and the phases are coarsened so that the 0.1% proof stress and tensile strength increase, and the elongation decreases at 25°C. In contrast, the effects of the Ni content on the tensile properties are negligible at 150°C and 200°C. The fatigue ductility exponent ¡ of the Sn 5SbNi solders is smaller than that of the Sn5Sb solder at 25°C. At 150°C and 200°C, the ¡ values of Sn5Sb0.05Ni and Sn5Sb0.10Ni remain small, whereas those of Sn5Sb0.25Ni and Sn5Sb0.50Ni increase. This means that the Sn5SbNi solders with 0.050.10 mass% Ni have superior fatigue properties to the Sn5Sb solder in the temperature range from 25°C to 200°C.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties

2019

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“…On the other hand, it is essential for the practical use of the power electronics devices using the power semiconductors that power module components be withstood high heat environment. In particular, a die-attach material used between the power semiconductors and an insulated substrate such as Al 2 O 3 and AlN requires both good tensile properties and high fatigue resistance [6,7]. In the present, Pb-rich solder alloys which is over 85 mass% Pb for high temperature environment are mainly used as the die-attach material despite Pb being toxic [8].…”

Section: Introductionmentioning

confidence: 99%

“…It is possible that the Sn-Sb solder alloys which have highest melting temperature range among existing lead-free solder alloys, are able to replace the Pb-rich solder alloys [7][8][9][10][11][12][13][14]. It has been reported that the Sn-Sb solder alloys have low electric resistivity and good mechanical properties [7,15]. However, in order to apply the Sn-Sb to the next-generation power semiconductors, it is necessary to further improve the tensile and fatigue properties in high temperature environment.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Kobayashi

Shohji

2019

Metals

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Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the β-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 °C. At 150 °C and 200 °C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 °C, the fatigue properties of Sn-10Sb-Ni with 0.10–0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10–0.25 mass% Ni have superior mechanical properties.

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“…Sn-Sb alloys are one of the candidates for the substitution of the Pb-rich solders [9][10][11]. It has been reported that Sn-5Sb (mass%) has excellent thermal fatigue behaviors and relatively high fracture strength [12,13]. In addition, in Sn-Sb alloys with high concentration of Sb, mechanical strength is improved by solid-solution of Sb in β-Sn matrix and dispersion of SbSn compounds [14].…”

Section: Introductionmentioning

confidence: 99%

Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

Kobayashi

Mitsui

et al. 2018

Advances in Materials Science and Engineering

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Tensile and low cycle fatigue properties of Sn-5Sb (mass%) and Sn-10Sb (mass%) were investigated using miniature size specimens, and fracture behaviors of the specimens were observed. Tensile strength and 0.1% proof stress of both alloys decrease with increasing the temperature. The tensile strength and 0.1% proof stress of Sn-10Sb are higher than those of Sn-5Sb at 25°C. Elongation of Sn-5Sb decreases with increasing the temperature except for a strain rate of 2 × 10−1 s−1, while Sn-10Sb increases with increasing temperature. Although elongation of Sn-10Sb is lower than that of Sn-5Sb at 25°C, the difference between them is small at 150°C. Chisel-point fracture was observed in both alloys regardless of conditions of the tensile test. The low cycle fatigue lives of Sn-5Sb and Sn-10Sb alloys obey the Manson–Coffin equation, and the fatigue ductility exponent, α, was 0.54 for Sn-5Sb and 0.46 for Sn-10Sb in the temperature range from 25°C to 150°C. On the basis of the observation of fractured specimens and the investigation of α, it was clarified that the crack progress can be delayed by the formation of coarse SbSn compounds in the Sn-Sb alloy, and thus the fatigue properties can be improved.

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Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

Cited by 11 publications

References 10 publications

Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties

Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties

Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

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