Tensile fracture characterization of braze joined copper-to-CFC coupon assemblies

Trester, P.W.; Valentine, Peter G.; Johnson, W. R.; Chin, E.; Reis, E.E.; Colleraine, A.P.

doi:10.1016/s0022-3115(96)00246-2

Cited by 17 publications

(5 citation statements)

References 3 publications

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“…For HT-7 device, joining DG to stainless steel by mechanical joining (using bolts) at present for tentative experiment, unfortunately, the thermal conductivity and strength of the assembly were not sufficiently satisfactory and therefore it cannot meet the high potential power requirement in the foreseeable future in HT-7U device (it is the update of HT-7) and to our best knowledge, there are very limited studies on chemical joining graphite to copper up to now (Appendino et al, 2004;Trester et al, 1996).…”

Section: Introductionmentioning

confidence: 99%

Brazing of doped graphite to Cu using stress relief interlayers

Zhong

Zhou

Chen

2009

Journal of Materials Processing Technology

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Section: Introductionmentioning

confidence: 99%

Brazing of doped graphite to Cu using stress relief interlayers

Zhong

Zhou

Chen

2009

Journal of Materials Processing Technology

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“…Since 1998, C/C composites have been selected as the first-wall protection material for the internal copper alloy cooling tubes in the cooling system protecting the vertical target of the International Thermonuclear Experimental Reactor (ITER) deflector due to their excellent overall performance, which are showed in Table 2 [38][39][40][41][42][43][44][45]. The ITER's engineering team achieved a reliable connection between the C/C composite and OF-Cu by brazing.…”

Section: Brazing Of C/c Composites With Copper and Copper Alloysmentioning

confidence: 99%

Carbon–Carbon Composite Metallic Alloy Joints and Corresponding Nanoscale Interfaces, a Short Review: Challenges, Strategies, and Prospects

Wang,

Yang,

Zeng

et al. 2023

Crystals

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Brazing of carbon–carbon (C/C) composites with metallic materials currently faces a series of difficulties, such as the poor wettability of metallic materials on the surface, the nanoscale interface bonding of C/C composites and metallic materials, thermal stress problems for these different materials, etc. Especially, the practical problems, including the low joint strength and insufficient reliability, still limit the large-scale practical application of brazing technology for C/C composites and metal materials. Herein, in order to guide the fabrication of high-quality joints, we present a brief discussion on the latest research progress in the joints of C/C composites and metallic materials, including current challenges, solution methods, mechanisms, and future prospects. More importantly, the nanoscale interface in the carbon–carbon composites and metallic alloys is paid very little attention, which has been critically discussed for the first time. Then, we further outline the possible solutions in joint problems of C/C composites and metallic materials, proposing feasible strategies to control the reaction in the brazing process, such as surface treatments, the addition of reinforcing phases, a transition layer sandwiched between the base material and the intermediate layer, etc. These strategies are being envisioned for the first time and further contribute to promoting the converged applications of C/C composites and metallic materials.

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“…High–output power semiconductor devices are promising components that improve energy efficiency for many electronic applications such as automobiles and high‐speed trains. In the manufacturing of high–output power semiconductor devices, joining metal and ceramics is required to improve thermal conductivity 1–8 …”

Section: Introductionmentioning

confidence: 99%

“…In the manufacturing of high-output power semiconductor devices, joining metal and ceramics is required to improve thermal conductivity. [1][2][3][4][5][6][7][8] We have previously reported a method of joining aluminum and silicon nitride by using an organosilicon polymer. 8,9 The polymer sandwiched by aluminum and a ceramic substrate could be transformed into a sort of glass layer such as aluminum silicate and SiAlON by thermal decomposition of the polymer and diffusion of atoms derived from the aluminum and substrate.…”

Section: Introductionmentioning

confidence: 99%

Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy

Kita

Hotta

2022

Int J Applied Ceramic Tech

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The effects of interposing a molten aluminum alloy layer between pure aluminum and silicon nitride on the strength of joining and properties of the joined sample were investigated. An aluminum‐based alloy containing 12 wt% silicon with a melting point lower than the 660°C melting point of pure aluminum was joined to pure aluminum and a silicon nitride substrate by using polymethylphenylsiloxane. A specimen with the same joining area (1600 mm2) and no alloy layer was prepared for comparison. In thermal cycling tests of Δ190 K, cooled at –40°C and heated at 150°C, the specimen without the alloy layer failed after 200 cycles, whereas the specimen with the alloy layer failed after 500 cycles. The bending strength of the sample with the alloy was approximately 1.5 times that of the sample without the alloy. These results indicate that the alloy layer facilitated the strong joining of the aluminum and substrate.

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Tensile fracture characterization of braze joined copper-to-CFC coupon assemblies

Cited by 17 publications

References 3 publications

Brazing of doped graphite to Cu using stress relief interlayers

Brazing of doped graphite to Cu using stress relief interlayers

Carbon–Carbon Composite Metallic Alloy Joints and Corresponding Nanoscale Interfaces, a Short Review: Challenges, Strategies, and Prospects

Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy

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