Terahertz Multi-Chip Module (T-MCM) technology for the 21st century?

Lucyszyn, S.; Silva, S.R.P.; Robertson, Iain; Collier, R.J.; Jastrzebski, Adam K.; Thayne, I.G.; Beaumont, S. P.

doi:10.1049/ic:19980202

Cited by 11 publications

(13 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Indeed, for these reasons, it is the waveguide of choice for non-tuneable/reconfigurable applications above circa 100 GHz and many diverse technologies exist to realize integrated forms of the MPRWG [3][4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Modelling of Reconfigurable Terahertz Integrated Architecture (Retina) Siw Structures

Zhou¹,

Lucyszyn²

2010

PIER

View full text Add to dashboard Cite

Abstract-This paper discusses for the first time the combined optoelectronic-electromagnetic modelling of a new technology that represents a paradigm shift in the way millimetre-wave and terahertz electronics can be implemented using the REconfigurable Terahertz INtegrated Architecture (RETINA) concept.Instead of having traditional metal-pipe rectangular waveguide structures with metal sidewalls, RETINA structures have photo-induced virtual sidewalls within a high resistivity silicon substrate. This new class of substrate integrated waveguide (SIW) technology allows individual components to be made tuneable and subsystems to be reconfigurable, by changing light source patterns. Detailed optoelectronic modelling strategies for the generation of virtual sidewalls and their electromagnetic interactions are presented in detail for the first time. It is found with double-sided illuminated RETINA structures that an insertion loss of 1.3 dB/λ g at 300 GHz is predicted for the dominant TE 10 mode and for a cavity resonator a Q-factor of 4 at 173 GHz is predicted for the TE 101 mode. While predicted losses are currently greater than other non-tuneable/reconfigurable SIW technologies, there is a wide range of techniques that can be investigated to considerably improve their performance, while still allowing completely arbitrary topologies to be defined in the x-z plane and in real time. For this reason, it is believed that this technology could have a profound impact on the future of millimetre-wave and terahertz electronics. As a result, this paper could be of interest to research groups that have the specialised experimental resources to implement practical demonstrator exemplars.

show abstract

Section: Introductionmentioning

confidence: 99%

Modelling of Reconfigurable Terahertz Integrated Architecture (Retina) Siw Structures

Zhou¹,

Lucyszyn²

2010

PIER

View full text Add to dashboard Cite

show abstract

“…The terahertz multi-chip module (T-MCM) technology is considered to be solution, which allows the cost-efficient manufacture of such devices [1]. The key building block of the T-MCM is the substrate integrated waveguide (SIW), an air or dielectric filled rectangular waveguide with wave propagation and isolation characteristics suitable for terahertz operation.…”

Section: Introductionmentioning

confidence: 99%

“…Currently, three technologies exist to realize SIWs: micro-machined air-filled waveguides [2], photoimageable dielectric filled thick film waveguides [3,4], and laminated dielectric filled waveguides [5,6]. The air-filled micromachined waveguides have excellent electrical performance, but the fabrication process, being a multistep lithographic process, is rather expensive [1]. The dielectric filled photoimageable thick film waveguide technology uses a very cost-efficient and mature fabrication technique suitable for mass production.…”

Section: Introductionmentioning

confidence: 99%

“…Microwave planar dual-mode bandpass filters have been having significant developments since their concepts were presented [1], and they have been designed with a great variety of configurations using dual-mode microstrip and patch resonators. Patch resonators are very attractive for applications in satellite and mobile communication systems where high performance with low insertion loss and high power handling are required [2].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

LTCC integrated air‐filled waveguides for G‐band applications

Tick

Jäntti

Henry

et al. 2008

Micro & Optical Tech Letters

View full text Add to dashboard Cite

“…Various monolithic active chips need to be interconnected with each other, but standard techniques, such as bond wires cannot be used due to large unknown parasitics. One of the possible solutions, still under development [1], is to use waveguides both for packaging and as interconnection media, with electromagnetic coupling between the chips and the waveguide. The simplest approach is to place the chip with suitable input and output slotline tapers in the E-plane of the waveguide (see Fig.…”

mentioning

confidence: 99%

A simple condition for maximum bandwidth of a chip packaged in an mm-wave waveguide

Jastrzebski

2002

32nd European Microwave Conference, 2002

View full text Add to dashboard Cite

Abstract- INTRODUCTIONComplex millimetre wave systems are difficult to construct due to packaging problems. Various monolithic active chips need to be interconnected with each other, but standard techniques, such as bond wires cannot be used due to large unknown parasitics. One of the possible solutions, still under development [1], is to use waveguides both for packaging and as interconnection media, with electromagnetic coupling between the chips and the waveguide. The simplest approach is to place the chip with suitable input and output slotline tapers in the E-plane of the waveguide (see Fig. 1). However, the effect of high permittivity (12.9 for GaAs) of a semiconductor chip on propagation modes in a waveguide needs to be investigated. Traditionally, finline structures consisting of a dielectric with a slotline placed in the E-plane were used to reduce the lower cut-off frequency of the fundamental mode, enabling usage of relatively small dimension waveguides at low frequencies. Unfortunately, the cut-off frequencies of the higher order modes are also reduced. When a waveguide is used as both interconnection medium and a package, then a useful bandwidth of the whole system is between the cut-off frequency of the fundamental mode of the empty waveguide and the first higher order mode of the waveguide with the chip. The electric loading from the semiconductor substrate of a chip and the slotline circuitry on it can dramatically reduce the cut-off frequencies of higher order modes and consequently cause severe reduction in a useful system bandwidth. These effects have been already investigated in [2]. For example for WR6 waveguide, when a finline with a relatively thick substrate of 200µm is used, the cut-off frequency of the first higher order mode is only 112 GHz, which is below the lower frequency of the practical bandwidth of a hollow WR6 waveguide. Waveguide packaging cannot be used in this case, as there is no useful bandwidth in the system. One way to increase the bandwidth is to use a very thin chip substrate. However, thinning GaAs or InP semiconductor substrates is not only quite expensive, but also produces very brittle chips that are difficult to handle. An alternative solution was proposed in [3], in which the slotline was mounted at an offset in a plane with zero electric field for TE 20 mode, rather than in the centre of the waveguide. It was shown that the frequency of the first higher order mode of the WR6 waveguide with a 200µm chip has increased by 14 GHz to 126 GHz, representing a substantial improvement. In this paper we use transverse resonance analysis to derive a simple implicit condition for an optimum offset of the chip. We compare the results obtained by the solution of this condition with those obtained from rigorous 3-D electromagnetic simulations of WR6 and WR10 waveguide packages for typical GaAs and InP chip dimensions, showing excellent agreement.

show abstract

Terahertz Multi-Chip Module (T-MCM) technology for the 21st century?

Cited by 11 publications

References 0 publications

Modelling of Reconfigurable Terahertz Integrated Architecture (Retina) Siw Structures

Modelling of Reconfigurable Terahertz Integrated Architecture (Retina) Siw Structures

LTCC integrated air‐filled waveguides for G‐band applications

A simple condition for maximum bandwidth of a chip packaged in an mm-wave waveguide

Contact Info

Product

Resources

About