Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices.

Nakamura, Shozo; Kushizaki, Yoshiyuki; Murakami, Gen; Koshi, Mitsuo

doi:10.5104/jiep.5.379

Cited by 8 publications

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New high reliability IC bonding film and its development

Ganatra

Ohashi²,

Tabuchi³

et al.

Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488)

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The die-attach adhesive used in CSP (Chip Size Package) is a crucial component that determines the reliability of CSP. This paper will describe a die-attach adhesive film with high reliability that has been developed using ePTFE (expanded polytetrafluoroethylene). Two structures have been made: trilayered and mono-layered adhesive films and their characteristics and differences are studied. Also, thermal residual stress and warp deformation behavior of BOC (Board On Chip) and the pBCA' package are analyzed with a viscoelasticity simulation. It is determined from this simulation that a BOC package using thin mono-layered adhesive film has nearly the same reliability as pBGA".

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New high reliability IC bonding film and its development

Ganatra

Ohashi²,

Tabuchi³

et al.

Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488)

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Analysis of Strain with Chemical Reaction During Warp Deformation for Viscoelastic Laminated Beam Consisted with Thermosetting Resin and Steel

Nakamura

Tanaka²,

Kimura³

2010

Trans.JSME, Ser.A

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Prediction of warp deformation for four-layer laminated structure containing resin by thermal load

Nakamura

Katsuyama

2016

Transactions of the JSME (In Japanese)

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The warp deformation behavior for various viscoelastic four-layer laminated structure consisting of epoxy resin, printed board and steel which modeled electronic devices caused by a series of thermal load from heating to cooling was examined by experiment and viscoelastic stress analysis based on linear viscoelastic theory. As a result, it was clarified that the warp deformation behavior of laminated structure containing resin was influenced by thickness and viscoelastic properties of epoxy resin and printed board such as modulus of longitudinal elasticity and thermal expansion coefficient depending on temperature and time， and that the warp deformation behavior of viscoelastic four-layer laminated structure was determined by the balance between flexural rigidity of laminated structure and bending moment caused with the thermal expansion or shrinkage of constituent materials. The warp deformation behavior of laminated structure containing resin could be predicted in general by analysis in consideration of the characteristic of viscoelasticity.

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Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices.

Cited by 8 publications

References 0 publications

New high reliability IC bonding film and its development

New high reliability IC bonding film and its development

Analysis of Strain with Chemical Reaction During Warp Deformation for Viscoelastic Laminated Beam Consisted with Thermosetting Resin and Steel

Prediction of warp deformation for four-layer laminated structure containing resin by thermal load

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