Ternary eutectic growth during directional solidification of Ag–Cu–Sb alloy

Abstract

2015): Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy, Philosophical Magazine Letters,The directional solidification process of ternary Ag 42.4 Cu 21.6 Sb 36 eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu 2 Sb) + ε(Ag 3 Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag 42.4 Cu 21.6 Sb 36 alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

“…Directional solidification 5 is one of the most important solidification methods used for material processing. The mechanical properties of the alloys can be improved by obtaining finer microstructure result from higher solidification rates and higher cooling rates under several directional solidification conditions [6][7][8][9][10][11][12][13] . The directionally solidified alloy exhibited higher strength than the non-directionally solidified alloy under the same cooling rate 14,15 .…”