2013 22nd Asian Test Symposium 2013
DOI: 10.1109/ats.2013.18
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Test Generation of Path Delay Faults Induced by Defects in Power TSV

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Cited by 4 publications
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“…They also examined feasibility of their electrical tests by Spice simulation and some experiments for a PCB circuit made of our prototyping IC that had been designed by the DFT method. Shih et al presented a defect simulation and test generation flow to detect path delay faults induced by defective power TSV in[72].We have already mentioned Ring Oscillators (ROs) in Subsection 2.1.2. The connection of two TSVs with some peripheral circuit to form an oscillation ring is a technique frequently used in TSV testing.…”
mentioning
confidence: 99%
“…They also examined feasibility of their electrical tests by Spice simulation and some experiments for a PCB circuit made of our prototyping IC that had been designed by the DFT method. Shih et al presented a defect simulation and test generation flow to detect path delay faults induced by defective power TSV in[72].We have already mentioned Ring Oscillators (ROs) in Subsection 2.1.2. The connection of two TSVs with some peripheral circuit to form an oscillation ring is a technique frequently used in TSV testing.…”
mentioning
confidence: 99%