Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

Abstract

In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor ( D f ), and square root of dielectric constant ( D k ). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D k and D f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm –3 ), a lower coefficient of thermal expansion (55 vs 76 ppm/°C), better dielectric characteristic at 10 GHz ( D k values of 2.58 vs 2.75, D f values of 0.005 vs 0.006), lower water absorption (0.135 vs 0.312 wt %), and better flame retardancy (UL-94 VTM-0 vs VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.

A facile method to fabricate thermally stable methacrylate‐terminated oligo(2,6‐dimethyl‐1,4‐phenylene oxide)/benzoxazine thermosetting resins with low dielectric constants and losses at 10 GHz

“…The polymerization reaction of SA9000 is through the free radical mechanism. 21,[38][39][40] It is found that the C C double bonds of SA9000 can be converted into C C single bonds in the presence of a peroxide as initiator. [38][39][40] Therefore, it is expected to create a series of B-f/SA9000 IPN films with good comprehensive properties.…”

“…21,[38][39][40] It is found that the C C double bonds of SA9000 can be converted into C C single bonds in the presence of a peroxide as initiator. [38][39][40] Therefore, it is expected to create a series of B-f/SA9000 IPN films with good comprehensive properties. Meanwhile, the curing temperatures of the prepared IPN prepolymers can be decreased as much as possible.…”