Texture development in polycrystalline thin films

Thompson, Carl V.; Carel, R.

doi:10.1016/0921-5107(95)03011-5

Cited by 307 publications

(183 citation statements)

References 32 publications

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“…The progressive disappearance of the in-plane texture as the inspected area is larger suggests the existence of different in-plane reorientation mechanisms operating to dissimilar scales (in particular, those responsible for the intra-and interstructure reorientation) and discards the possibility that the surface large structures [in Fig 1(d)] result from a grain growth based upon texture selection processes. 20 The fact that the polycrystalline film bulk isolates mechanically the surface layer from the stiffener Si substrate (as discussed above) makes possible the reorientation giving rise to the in-plane texture, which would be frustrated otherwise given the higher shear modulus of Si.…”

Section: Resultsmentioning

confidence: 99%

Morphology evolution of thermally annealed polycrystalline thin films

et al. 2011

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Investigation of the morphology evolution of annealed polycrystalline Au(111) films by atomic force microscopy and x-ray diffraction leads to a continuous model that correlates such an evolution to local interactions between grains triggering different mechanisms of stress accommodation (grain zipping and shear strain) and relaxation (gap filling and grain rotation). The model takes into consideration findings concerning the in-plane reorientation of the grains during the coalescence to provide a comprehensive picture of the grain-size dependence of the interactions (underlying the origin of the growth stress in polycrystalline systems); and in particular it sheds light on the postcoalescence compressive stress as a consequence of the kinetic limitations for the reorientation of larger surface structures.

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Section: Resultsmentioning

confidence: 99%

Morphology evolution of thermally annealed polycrystalline thin films

et al. 2011

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“…21,22 Both of these types of stress result in mass transport of Sn atoms from the highly stressed region to the whisker root; this is generally accepted as the phenomenon driving growth of tin whiskers and hillocks. 18,21 Because stress, global or local, also depends on crystallographic texture, which may be predominantly determined by electrodeposition process conditions, for example current density, deposition temperature, bath agitation, etc., [23][24][25][26][27] it is important to study such correlations; we summarize below various reports addressing these issues.…”

Section: Introductionmentioning

confidence: 99%

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Jagtap

Kumar

2015

Journal of Elec Materi

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The effects of two major electrodeposition process conditions, electrolyte bath temperature and current density, on the microstructure and crystallographic texture of pure tin coatings on brass and, ultimately, on the extent of whisker formation have been examined. The grain size of the deposited coatings increased with increasing electrolyte bath temperature and current density, which significantly affected the dominant texture: (211) or (420) was the dominant texture at low current densities whereas, depending on deposition temperature, (200) or (220) became the dominant texture at high current densities. After deposition, coatings were subjected to different environmental conditions, for example isothermal aging (room temperature, 50°C, or 150°C) for up to 90 days and thermal cycling between À25°C and 85°C for 100 cycles, and whisker growth was studied. The Sn coatings with low Miller index planes, for example (200) and (220), and with moderate aging temperature were more prone to whiskering than coating with high Miller index planes, for example (420), and high aging temperature. A processing route involving the optimum combination of current density and deposition temperature is proposed for suppressing whisker growth.

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“…The (110) and other low yield stress grains could dominate during grain growth in highly strained films, if part of the strain has been plastically accommodated 12 .…”

Section: Discussionmentioning

confidence: 99%

“…Simple models for the flow stress of a grain in a polycrystalline film suggested that, for equal-sized grains with (111), (100) and (110) texture, the (110) textured grains have the lowest yield stress, and (111) textured grains had the highest 12 . From Figure 5a, a mount of extinction fringes in the grain interior were observed for as-deposited sheet which means that the stresses would be released during annealing process.…”

Section: Discussionmentioning

confidence: 99%

Microstructure Evolution of Electron Beam Physical Vapour Deposited Ni-23.5Cr-2.66Co-1.44Al Superalloy Sheet During Annealing at 600 °C

Zhang

Zhong

et al. 2012

Mat. Res.

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Microstructure evolution of electron beam physical vapour deposited (EB-PVD) Ni-23.5Cr-2.66Co-1.44Al superalloy sheet during annealing at 600 °C was investigated. The results showed that the as-deposited alloy was composed of only γ phase. After annealing at 600 °C, the locations of diffraction peaks were still the same. The (220) diffraction peak of the deposition side increased with annealing time. The sheet on deposited side had a tendency toward forming (220) texture during post-annealing. No obvious texture was observed at as-deposited and annealed sheet at 600 °C in substrate side. The count and size of "voids" decreased with time. The size of grains increased obviously with annealing time. The ultimate tensile strength of EB-PVD Ni-23.5Cr-2.66Co-1.44Al alloy sheet increased from 641 MPa to 829 MPa after annealing at 600 °C for 30 hours.

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Texture development in polycrystalline thin films

Cited by 307 publications

References 32 publications

Morphology evolution of thermally annealed polycrystalline thin films

Morphology evolution of thermally annealed polycrystalline thin films

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Microstructure Evolution of Electron Beam Physical Vapour Deposited Ni-23.5Cr-2.66Co-1.44Al Superalloy Sheet During Annealing at 600 °C

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