Texture Evolution and Nanohardness in Cu-Nb Composite Wires

Abstract

Multifilamentary microcomposite copper-niobium (Cu-Nb) wires were fabricated by a series of accumulative drawing and bonding steps (ADB). The texture of the Cu matrix in these wires was studied using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). Dynamic recrystallization during cold drawing caused a weakening of the <111> texture in the micron-scale Cu matrix at high values of true strain. A sharp <111> texture was observed in the nano-scale Cu matrix due to the suppression of dynamic recrystallization. The grain size was reduced by the higher level of dynamic recrystallization at high strains. The relation between the nanoindentation behavior of the different Cu matrix and the grain sizes, Cu-Nb interface, and texture was established.

Hardness–Deformation Energy Relationship in Metals and Alloys: A Comparative Evaluation Based on Nanoindentation Testing and Thermodynamic Consideration

“…Hardness testing is widely used to evaluate the plastic deformability of materials. In the last few decades, nanoindentation testing methods [ 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 ] have been developed and are rapidly becoming widespread for the evaluation of various materials, including steels [ 19 ], tungsten [ 20 ], copper [ 21 ], and NiTi alloys [ 22 ]. This has produced new metallurgical knowledge about nanoscale deformation that is useful for the development of superior materials.…”

Microstructural Features in Multicore Cu–Nb Composites

“…The main feature is the complex morphology of curved niobium ribbon-shaped filaments (Figure 1c,f). This morphology has been observed in various types of Cu-Nb composites and is attributed to the peculiarities of slipping systems in the BCC Nb and the influence of the FCC copper matrix [3,8,11,[31][32][33][34][35].…”