2009
DOI: 10.1016/j.jpcs.2009.06.002
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Texture of bismuth telluride-based thermoelectric semiconductors processed by high-pressure torsion

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Cited by 36 publications
(18 citation statements)
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“…HPT processing gave rise to an increased power factor S 2 /q caused by a (110) texture contributing to both a low resistivity and a high Seebeck coefficient, 76 whereas a real increase of ZT was achieved by the ECAP procedure 77 by carefully choosing the ECAP temperature and path to obtain a high carrier mobility, thus minimizing the electrical resistivity and thereby achieving a figure of merit as high as ZT = 2.3.…”
Section: Thermoelectricity and Superconductivitymentioning
confidence: 99%
“…HPT processing gave rise to an increased power factor S 2 /q caused by a (110) texture contributing to both a low resistivity and a high Seebeck coefficient, 76 whereas a real increase of ZT was achieved by the ECAP procedure 77 by carefully choosing the ECAP temperature and path to obtain a high carrier mobility, thus minimizing the electrical resistivity and thereby achieving a figure of merit as high as ZT = 2.3.…”
Section: Thermoelectricity and Superconductivitymentioning
confidence: 99%
“…There have been several attempts to increase ZT by application of SPD, mainly HPT [147] and ECAP. [148] HPT processing gave rise to an increased power factor S 2 /ρ due to a (110) texture contributing to both a low resistivity and a high Seebeck coefficient (Figure 20,[147]).…”
Section: Thermoelectricsmentioning
confidence: 99%
“…These effects seem to ameliorate the performance of a thermoelectric material [1][2][3][4][5][6], which is characterised by the figure of merit…”
Section: Introductionmentioning
confidence: 99%