2003
DOI: 10.1109/tasc.2003.812296
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Texture-related roughness of (Nb,Ti)N sputter-deposited films

Abstract: Abstract-We study the properties of (Nb,Ti)N films deposited by reactive magnetron sputtering in an atmosphere of argon and nitrogen at ambient substrate temperature, focusing, in particular, on the technological factors determining film texture and roughness. We find that increasing the adatom energy, while keeping

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Cited by 12 publications
(7 citation statements)
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“…Literature [18,21,22] also indicated that for the sput tered superconductor material initial compressive stresses at room temperature may be present up to 2 GPa.…”
Section: A Model Setupmentioning
confidence: 99%
“…Literature [18,21,22] also indicated that for the sput tered superconductor material initial compressive stresses at room temperature may be present up to 2 GPa.…”
Section: A Model Setupmentioning
confidence: 99%
“…[48][49][50][51][52] The potential energy of an adatom depends on the crystallographic orientation it is placed onto. Correspondingly, the barrier for diffusion increases or decreases.…”
Section: F62mentioning
confidence: 99%
“…Just as in the case of electrochemical activities, these differences can only be explained on the grounds of differences in incident atom energies. [48][49][50][51][52] The potential energy of an adatom depends on the crystallographic orientation it is placed onto. Correspondingly, the barrier for diffusion increases or decreases.…”
Section: F62mentioning
confidence: 99%
“…On the other side, it is widely known that in reactive sputter deposited films the nature and properties of the films depend on the process parameters such as the system geometry, sputtering rate, target-to-substrate distance, substrate temperature and the pressures of the sputtering and reactive gas [12][13][14][15][16][17][18]. The incorporation of the reactive species to the film is believed to take place through different mechanisms depending on the effective reactive gas pressure: (i) for low reactive gas pressure, incorporation occurs mainly by chemisorption of the reactive species onto the target, the forming film and the chamber walls; this way, reactive gas becomes trapped and its partial pressure reduces; (ii) near the pressure critical value, the chemisorption onto the target exceeds the sputtering rate and thereafter abrupt changes in the sputtering regime are observed, i.e.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, as in glow discharge processes, negative and/or reflected ions are usually produced [19]. The composition, microstructure and morphology of the deposited layers would also depend on the process variables such as the target-substrate geometry, substrate temperature and reactive gas pressure [16][17][18][19][20]. In this work, the CdTe oxide films were prepared at low substrate temperature and variable N 2 O partial pressures to study the influence of these parameters on the morphology, composition and microstructure.…”
Section: Introductionmentioning
confidence: 99%