Modern highly integrated microelectronic devices are
unable to
dissipate heat over time, which greatly affects the operating efficiency
and service life of electronic equipment. Constructing high-thermal-conductivity
composites with 3D network structures is a hot research topic. In
this article, carbon fiber felt (CFF) was prepared by airflow netting
forming technology and needle punching combined with stepped heat
treatment. Then, carbon-coated carbon fiber felt (C@CFF) with a three-dimensional
network structure was constructed in situ by high-temperature chemical
vapor deposition (CVD). Finally, high-temperature treatment was used
to improve the degree of crystallinity of C@CFF and further enhance
its graphitization. The epoxy (EP) composites were prepared by simple
vacuum infiltration–molding curing. The test results showed
that the in-plane thermal conductivity (K
∥) and through-plane thermal conductivity (K
⊥) of EP/C@CFF-2300 °C could reach up to 13.08
and 2.78 W/mK, respectively, where the deposited carbon content was
11.76 vol %. The in-plane thermal conductivity enhancement (TCE) of
EP/C@CFF-2300 °C was improved by 6440 and 808% compared to those
of pure EP and EP/CFF, respectively. The high-temperature treatment
greatly provides an improvement in thermal conductivity for the in-plane
and the through-plane. Infrared imaging showed excellent thermal management
properties of the prepared epoxy composites. EP/C@CFF-2300 °C
owned an in-plane AC conductivity of up to 0.035 S/cm at 10 kHz, and
Lorentz–Drude-type negative permittivity behaviors were observed
at the tested frequency region. The CFF thermally conductive composites
prepared by the above method have a broad application prospect in
the field of advanced thermal management and electromagnetics.