The adhesion strength of A lead-free solder hot-dipped on copper substrate

Yu, Seung Min; Hon, Min–Hsiung; Wang, Moo–Chin

doi:10.1007/s11664-000-0149-6

Cited by 45 publications

(23 citation statements)

References 28 publications

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“…This tendency is in agreement with many previous results. 21,22 In addition, the yield strengths of those samples are in the range of 15-20 MPa, and the samples exhibited strong strain hardening during the tensile test, as shown in Fig. 3.…”

Section: Morphology and Growth Kinetics Of Interfacial Intermetallic mentioning

confidence: 96%

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

Zhang

Zou

Zhang

2009

Journal of Elec Materi

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Tensile properties and stress-controlled fatigue fracture behaviors of Cu/Sn-4Ag solder joints aged at 180°C for different times were systematically investigated. It was found that the tensile strength of the solder joints decreased with increasing aging time and that the fracture mode changed from ductile to brittle. The fatigue life of the solder joints also decreased with increasing aging time. For most of the solder joints, fatigue cracks tended to initiate around the Cu/Cu 6 Sn 5 interfaces due to the strain incompatibility and local strain concentration on a micro-scale, and they then propagated within the solder proximately along the Cu/Cu 6 Sn 5 interfaces. The samples aged for different times or tested under different stress amplitudes had similar fractography morphologies, which consisted mainly of a propagation region, covered by solder, and a final fracture region. Based on the experimental observations above, the corresponding interfacial fatigue failure mechanisms were discussed in terms of different influencing factors.

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Section: Morphology and Growth Kinetics Of Interfacial Intermetallic mentioning

confidence: 96%

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

Zhang

Zou

Zhang

2009

Journal of Elec Materi

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“…When the Sn-Zn solders wet on Cu substrate, the Zn atoms would compete with Sn atoms for reaction with Cu [44,45]. Yu et al explain that the diffusivity of Sn in the Cu-Sn alloy is given by D Sn ¼ 1.9 Â 10 À10 cm 2 /s and the diffusivity of Zn in the Cu-Zn alloy is D Zn ¼ 2.7 Â 10 À10 cm 2 /s at 300 C [46]. This shows that at 300 C (molten state), the diffusivity of D Zn > D Sn and explains the formation of g-Cu 5 Zn 8 phase instead of h 0 -Cu 6 Sn 5 compound during the soldering process.…”

Section: Intermetallic Formationmentioning

confidence: 99%

“…The second reason can be explained from thermodynamic point of view [46][47][48]. The Gibbs free energy of g-Cu 5 Zn 8 formation is much lower than that of h 0 -Cu 6 Sn 5 and 3-Cu 3 Sn phases, and would be more stable.…”

Section: Intermetallic Formationmentioning

confidence: 99%

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

Mayappan

Ahmad

2010

Intermetallics

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“…This can be explained by several reasons. The first reason is that the diffusion rate of Zn in the Cu 5 Zn 8 alloy, D Zn ¼ 2.7 x10 À10 cm 2 /s, is faster compared to that of Sn in the Cu 6 Sn 5 alloy, D Sn ¼ 1.9 Â 10 À10 cm 2 /s [36]. The second reason is the Gibbs free energy of Cu 5 Zn 8 (DG ¼ À12.34 kJ/mol) formation is much lower than that of Cu 6 Sn 5, (DG ¼ À7.42 kJ/mol) and Cu 3 Sn (DG ¼ À7.78 kJ/mol) [36,37].…”

Section: Results and Dicussionmentioning

confidence: 99%