2019
DOI: 10.1016/j.jmapro.2019.10.029
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The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

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Cited by 13 publications
(5 citation statements)
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“…It can be seen that Ṫ decreased with the progress of solidification from the cooled bottom of the casting due to two reasons: 1) The continuous growth from bottom to top of the casting increases progressively the thermal resistance of the solid layer; [ 32 ] 2) the thermal and volumetric shrinkage accompanying the solidification of the casting generates an increasing gap between the casting and the mold wall, thus inducing an interfacial thermal resistance that increases over time. [ 33,34 ] In previous studies, [ 35–39 ] the fishbone morphology was reported to be dependent on Ṫ and V and on the composition of the alloy. Particularly, high cooling rates and increase in a specific solute content promoted the formation of fishbone intermetallic particles.…”
Section: Resultsmentioning
confidence: 99%
“…It can be seen that Ṫ decreased with the progress of solidification from the cooled bottom of the casting due to two reasons: 1) The continuous growth from bottom to top of the casting increases progressively the thermal resistance of the solid layer; [ 32 ] 2) the thermal and volumetric shrinkage accompanying the solidification of the casting generates an increasing gap between the casting and the mold wall, thus inducing an interfacial thermal resistance that increases over time. [ 33,34 ] In previous studies, [ 35–39 ] the fishbone morphology was reported to be dependent on Ṫ and V and on the composition of the alloy. Particularly, high cooling rates and increase in a specific solute content promoted the formation of fishbone intermetallic particles.…”
Section: Resultsmentioning
confidence: 99%
“…Although hardness can be considered an important characteristic for TIM applications, further tests involving other important properties are necessary such as tensile properties, [64] wettability of the alloy against different substrates, [65] and the corresponding thermal interface resistance. [66]…”
Section: Resultsmentioning
confidence: 99%
“…This gives an acceptable explanation of why although λ 1 and λ 2 are finer at regions closer to the cooled bottom of the Bi–20 wt% Sb alloy casting, the HV values are lower as compared with those of positions toward the top of the DS casting. Although hardness can be considered an important characteristic for TIM applications, further tests involving other important properties are necessary such as tensile properties, wettability of the alloy against different substrates, and the corresponding thermal interface resistance …”
Section: Resultsmentioning
confidence: 99%
“…In this case, neither a more refined microstructure nor even a greater amount of hard particles (SnSb) generated enough cutting efforts for the machining heating rates of the Sn-5.5wt%Sb alloy to be higher than those of the Sn-2.0wt %Sb. The softening or melting of the material during the cutting process leads to the formation of a false edge, which, depending on the amount, takes on the cutting function, impairing the finish of the piece [41][42][43][44].…”
Section: Machinabilitymentioning
confidence: 99%