1990
DOI: 10.1007/bf00581072
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The bonding mechanism of aramid fibres to epoxy matrices

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Cited by 71 publications
(31 citation statements)
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“…The bonding between these brils is rather weak, which makes the bers susceptible to damage due to external abrasion as well as causes low compression strength. The weak inter-bril bonds also limit the degree of improvement in aramid / matrix interfacial bond strength since the brils on surface of the ber can be peeled away before the ber /matrix interface fails [32,33]. To improve inter bril bond strength, Mathur and Netravali [34] used epoxy and bismaleimide to in ltrate the inter bril space of aramid bers after swelling the bers with concentrated sulfuric acid.…”
Section: Single Ber Tensile Strengthmentioning
confidence: 98%
“…The bonding between these brils is rather weak, which makes the bers susceptible to damage due to external abrasion as well as causes low compression strength. The weak inter-bril bonds also limit the degree of improvement in aramid / matrix interfacial bond strength since the brils on surface of the ber can be peeled away before the ber /matrix interface fails [32,33]. To improve inter bril bond strength, Mathur and Netravali [34] used epoxy and bismaleimide to in ltrate the inter bril space of aramid bers after swelling the bers with concentrated sulfuric acid.…”
Section: Single Ber Tensile Strengthmentioning
confidence: 98%
“…In this context, and due to the interesting of these fibres for military and civil applications, several studies can be found to improve the impact strength of the systems where they are involved. The low surface energy and chemically inert surface motivated several works to improve their interfacial adhesion with the matrices, but other techniques like stitching, multiaxial warp‐knit fabrics, by fibre hybridisation or the resource to nano‐enhanced resins can be found in the literature.…”
Section: Introductionmentioning
confidence: 99%
“…The adhesion achieved between aramid fibers and epoxy matrices were much lower than that obtained by other, inorganic reinforcing fibers. In their own study on the bonding mechanism between aramid fibers and epoxy matrices, Kalantar and Drzal [58] showed that epoxy resin shrinkage is not a primary cause of sometimes insufficient adhesion of aramid fibers to epoxy matrices and that the curing temperature does not influence the composite failure mechanism. The close match of aramid radial thermal expansion coefficient and its Poisson ratio to those of the matrix reportedly results in lower interfacial radial stresses for the aramid fiber-epoxy interface, as compared to carbon fiber-epoxy interface.…”
Section: Epoxy Resin Matricesmentioning
confidence: 98%
“…Moreover, the maximum values of ISS derived at different loading levels, can be used to characterize the interfacial properties of aramid/epoxy model composites. It is appropriate to mention here that ISS is proportional to the fiber tensile strength and diameter divided by the final fiber fragment length [58]. Based on the Raman response of aramid fibers, a multifunctional non-destructive test was proposed for Kevlar/epoxy laminates [60].…”
Section: Epoxy Resin Matricesmentioning
confidence: 99%