The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications

Zhang, Hongwen; Aserian, Kyle; Hu, David; Chen, Bo; Richmond, Tyler; Hu, Leo; Zhu, Kaiyuan; Alin, Mary Jane R.

doi:10.1109/ectc51529.2024.00179

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00179

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The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications

Hongwen Zhang,

Kyle Aserian,

David Hu

et al.

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The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications

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