The Characteristics of Nickel-Electroplating on Copper Substrate in CO₂ Supercritical Fluid

Abstract

In this work, a nickel electroplating was performed on the copper substrate using nonionic surfactant in supercritical carbon dioxide to improve the dispersion characteristics of nickel nano-particles. The electric resistance of emulsion decreased rapidly from 46 to 25 Ω with an increasing pressure from 8 MPa to 16 MPa and was nearly constant at 25 Ω over 14 MPa. The conductivity of emulsion solution was highest at nonionic surfactant concentration of 0.1 vol% and the dispersion of nickel nano-particles was better than at any other concentration. CO2 concentration was controlled under 0.5 vol% to reduce electric resistance in emulsion solution. Roughness (Ra) of copper substrate without plating was 0.084 ㎛, however, that of nickel film plated for 10 min was smoothed to 0.020 ㎛ and the surface of nickel film plated was smoothed with an increasing plating time. The plating properties of nickel in CO2 supercritical fluid showed better properties than in conventional method.

Study of laser cladding Fe–Co duplex coating on copper substrate

“…Copper is being widely used as crystallizer in continuous casting and rolling due to its excellent electrical and thermal conductivity [1][2][3][4][5][6]. However, the low strength and poor wear resistance limit its applications [2].…”

“…In recent years, it has become a new research hotspot to improve the wear resistance of copper by preparing surface coating. Many techniques, such as electroplating, infiltration and thermal spraying, have been utilized to solve the low physical performance of copper [3][4][5]. However, the coating is generally mechanically bonded with the matrix, which cannot meet the technical requirements under special conditions.…”

Simulation and Test Analysis on Effect of Current Density on Electrodepositing Minuteness Structure under Supercritical Fluids

“…In order to adapt to the special requirements of materials in current medical biology, aerospace, microelectro-mechanical systems (MEMS) and other fields, composite electrodepositing technology is often used for its unique ability to prepare high-performance precision metal matrix composites [1,2]. Technical limitations existing in the traditional composite electrodepositing technology including low mass transfer efficiency, mixing solubility, and low dispersion ability of ions, were solved by this technology under a supercritical fluid (SCF) [3,6]. The presence of supercritical composite electrodepositing technology has been reported [7,8] but using supercritical composite electrodepositing technology to prepare micro films is reposted only on rare occasions.…”

Characterization of copper-plated conductive fibers after pretreatment with supercritical carbon dioxide and surface modification using Lyocell fiber

“…However, there were several problems associated with the conventional pretreatment process of electroless metal plating, such as the many complicated stages that include surface adjustment, neutralization, etching, catalysis and acceleration. 14 To solve these problems, we have researched pretreatment with supercritical carbon dioxide (scCO 2 ) for giving Pd metal to a polymer substrate.…”