2015
DOI: 10.1166/asem.2015.1689
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The Combined Technological Methods for Deposition of Si:H Thin Films and Structures with Embedded NPs

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Cited by 7 publications
(5 citation statements)
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“…The nonlinear fitting of the implicit function I=I(U,I) was carried out via the Wolfram Mathematica software. The generation–recombination model with n = 2 fits the measured data well for low values of current densities at voltages U < 0.6 V. The forward current densities at voltages U > 0.6 V are dominated by effects not included in Equation but at U > 2 V, they asymptotically approach the data for high forward current densities where the series resistance R s dominates current–voltage characteristics . We attribute the relatively high R s to the resistivity of the B‐NCD electrode.…”
Section: Resultsmentioning
confidence: 65%
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“…The nonlinear fitting of the implicit function I=I(U,I) was carried out via the Wolfram Mathematica software. The generation–recombination model with n = 2 fits the measured data well for low values of current densities at voltages U < 0.6 V. The forward current densities at voltages U > 0.6 V are dominated by effects not included in Equation but at U > 2 V, they asymptotically approach the data for high forward current densities where the series resistance R s dominates current–voltage characteristics . We attribute the relatively high R s to the resistivity of the B‐NCD electrode.…”
Section: Resultsmentioning
confidence: 65%
“…Here, q = 1.602 × 10 −19 C is the elementary charge, k B = 1.381 × 10 −23 JK −1 the Boltzmann constant, T = 300 K, n an ideality factor , and A a contact area . The absolute value of the dark current density of the selected diode recalculated on the diode area as a function of the voltage U is shown in Figure A, together with the fitted curve followed from Equation .…”
Section: Resultsmentioning
confidence: 99%
“…Another question is the problem of convenient light sources for all silicon photonic . Our effort in previous years has been focused on the development of deposition systems which allow in situ deposition of amorphous or microcrystalline Si:H (a‐Si:H or μc‐Si:H) thin films with embedded nanoparticles (NPs) . The fundamental problem in this method is the relatively low temperature, i.e., about 220 °C, required for device quality a‐Si:H thin films during the PECVD process.…”
Section: Introductionmentioning
confidence: 99%
“…[3] Our effort in previous years has been focused on the development of deposition systems which allow in situ deposition of amorphous or microcrystalline Si:H (a-Si:H or μc-Si:H) thin films with embedded nanoparticles (NPs). [4][5][6] The fundamental problem in this method is the relatively low temperature, i.e., about 220 C, required for device quality a-Si:H thin films during the PECVD process. The bandgap of a-Si:H is narrow, and therefore we have tested semiconductor NPs whose bandgap is limited to the bandgap of a-Si:H. The deposition temperature 220 C is also too low for formation of crystalline NPs.…”
Section: Introductionmentioning
confidence: 99%
“…Another disadvantage of the vacuum process interruption was the oxidation or contamination of the surface by organic residue when exposed to air. Therefore, we have switched to the insitu techniques such as reactive deposition epitaxy (RDE) [4], laser ablation [5] and the magnetron sputtering followed by plasma treatment [6]. The in-situ formation of silicide NPs by RDE and laser ablation was confirmed by the Auger electron spectroscopy (AES) and electron energy loss spectroscopies (EELS) and by the optical absorbance and Raman spectroscopy [7].…”
Section: Introductionmentioning
confidence: 99%