The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating

Zhou, Yilin; Huo, Yujia

doi:10.1007/s10854-015-3836-z

Cited by 19 publications

(6 citation statements)

References 17 publications

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“…Electroless silver coating is one of the electroless coating techniques, and it can be easily applied on the copper surface. The higher oxidation resistance of silver than copper and higher electrical and thermal conductivity properties are provided to prefer this technique to improve the oxidation resistance of copper [13][14][15][16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

et al. 2022

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In this study, copper powders with dendritic morphology were produced by the electrolysis method, and then silver coating was applied to these powders by an electroless coating method. The bulk samples were fabricated by hot pressing method using different ratios of copper and silver-plated copper powders. The results showed that the electroless silver coating layer provided a strong bond at the particle boundaries of the samples, significantly improving the physical and mechanical properties of the materials. Accordingly, the hardness, tensile strength, electrical and thermal conductivity values of the samples produced from silver-plated dendritic copper particles were determined to be approximately 98 HB, 185 MPa, 102 IACS% and 402 W mK −1 , respectively. In addition, the oxidation resistance of the sample produced from completely silver-coated copper powders is 4 times higher than that of pure copper.

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Section: Introductionmentioning

confidence: 99%

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

et al. 2022

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“…Many different approaches have been adopted to deposit metals or metal oxides on fibrous surfaces [12]. Electroless plating is a useful method as it can deposit metallic as well as non-metallic materials without the need for electrically conductive substrates [13].…”

Section: Introductionmentioning

confidence: 99%

One-Pot Decoration of Cupric Oxide on Activated Carbon Fibers Mediated by Polydopamine for Bacterial Growth Inhibition

2020

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Despite the widespread application of activated carbon fiber (ACF) filters in air cleaning owing to their high surface area and low price, they have certain limitations in that they facilitate bacterial growth upon prolonged use as ACF filters can provide favorable conditions for bacterial survival. The deposition of cupric oxide (CuO) on ACFs can be an effective way of resolving this problem because CuO can inhibit the proliferation of bacteria owing to its antimicrobial properties. However, finding a new method that allows the simple and uniform coating of CuO on ACF filters is challenging. Here, we demonstrate one-pot CuO deposition mediated by polydopamine (PD) to realize an ACF filter with antimicrobial activity. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS) analyses reveal that CuO and PD are uniformly deposited on the ACF surface. The amount of CuO formed on the ACFs is measured by thermogravimetric analysis (TGA). Finally, the changes in surface area, pressure drop, and antimicrobial activity after coating PD-CuO on the ACFs are evaluated. The use of PD-CuO on the ACFs effectively suppresses the growth of bacteria and enhances the mechanical properties without significantly sacrificing the original characteristics of the ACF filter.

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“…ECM failure is unavoidable and affects the insulation reliability of high-density electric assemblies. 3 Traditional Sn-Pb solders are extensively used in electronic industries to connect integrated circuit chips and substrates at all levels of interconnecting applications, from the rst level to the second, owing to their low cost, good solderability, low melting temperature, and satisfactory mechanical properties. 4,5 However, the inherent toxicity of lead has caused many countries to ban lead from electronic products.…”

Section: Introductionmentioning

confidence: 99%

Na₂S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions

et al. 2017

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The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating

Cited by 19 publications

References 17 publications

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

One-Pot Decoration of Cupric Oxide on Activated Carbon Fibers Mediated by Polydopamine for Bacterial Growth Inhibition

Na₂S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions

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The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating

Cited by 19 publications

References 17 publications

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

Novel advanced copper-silver materials produced from recycled dendritic copper powders using electroless coating and hot pressing

One-Pot Decoration of Cupric Oxide on Activated Carbon Fibers Mediated by Polydopamine for Bacterial Growth Inhibition

Na2S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions

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Na₂S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions