2017
DOI: 10.1016/j.cplett.2017.04.043
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The competition of densification and structure ordering during crystallization of HCP-Mg in the framework of layering

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Cited by 4 publications
(3 citation statements)
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“…48 This technique has previously been validated to accurately identify BCC (body-centered cubic), FCC, and HCP (hexagonal close-packed), as well as the liquid (amorphous or icosahedral), atoms in any complicated metallic system. 49–51 In fact, Voronoi tessellation also plays a fundamental role in this hybrid method. The twinning GBs colored ochre in Fig.…”
Section: Application To Three Typical Scenariosmentioning
confidence: 99%
“…48 This technique has previously been validated to accurately identify BCC (body-centered cubic), FCC, and HCP (hexagonal close-packed), as well as the liquid (amorphous or icosahedral), atoms in any complicated metallic system. 49–51 In fact, Voronoi tessellation also plays a fundamental role in this hybrid method. The twinning GBs colored ochre in Fig.…”
Section: Application To Three Typical Scenariosmentioning
confidence: 99%
“…Sestito et al [9] addressed the sintering kinetics and densification rates of nickel nanoscale particles as a function of grain boundary misorientation. Luo et al [10] performed an NPT molecular dynamics simulation of the crystallization process of HCP-Mg to probe the competition relationship between the densification and the structural ordering. It can be concluded that the densification process of metal sintering is closely related to the evolution of the corresponding microstructure.…”
Section: Introductionmentioning
confidence: 99%
“…Liu [14] firstly revealed the rule of atomic migration and the growth mechanism of the sintering neck through simulation. On the whole, the previous simulation research work [9][10][11][12][13][14] covers the key issues such as sintering influencing factors, microstructure evolution, sintering neck, densification, etc. Nevertheless, it is difficult to obtain a complete sintering mechanism from these unsystematic works, especially for nanocopper.…”
Section: Introductionmentioning
confidence: 99%