The Complete Design of Microstrip Directional Couplers Using the Synthesis Technique

Eroğlu, Abdullah; Lee, Jay Kyoon

doi:10.1109/tim.2008.926391

Cited by 26 publications

(29 citation statements)

References 5 publications

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“…The contact-less method of chip-to-chip high speed data transmission monitoring account aforementioned assumptions it is possible to design a differential signal coupler which does not affect the transmission in the main line with the desired level of decoupling, using well known synthesis methods described in [13,14]. Let us assume that the coupling factors for both branches are equal (C 54 = C 71 = C B ).…”

Section: Differential Signal Couplermentioning

confidence: 99%

“…The distance s C between the transmission line and the branch of the coupler can be determined using the dependencies below [13] (s c /h) = 2 π cosh…”

Section: Differential Signal Couplermentioning

confidence: 99%

“…The parameter (w c /h)′ so is expressed as a sum of (w c /h) so and (w c /h) se with constant factors. Parameters (w c /h) so , (w c /h) se are calculated by changing auxiliary parameter Rto (Z oo /2) for (w c /h) so and (Z oe /2) for (w c /h) se in the equation [13]:…”

Section: Differential Signal Couplermentioning

confidence: 99%

“…This property implies that for real digital signals the natural pre-equalization will take place (the high frequency signal components with relatively low level of power will be enhanced in comparison to the lower frequency components). Using the design equations for classical couplers presented in [13,14] we can calculate, for the FR-4 laminate with ε r = 4.4 and H = 1.55 mm, the coupler's branch width w C = 3.02 mm and the distance between transmission line and coupler's branch s C = 1.59 mm. The length of the coupler branch is L C = 41.33 mm.…”

Section: Coupler Design and Directivity Optimizationmentioning

confidence: 99%

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The contact-less method of chip-to-chip high speed data transmission monitoring

Zmuda¹,

Szczepański²,

Kozieł³

et al. 2014

Bulletin of the Polish Academy of Sciences: Technical Sciences

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Abstract. This paper presents a technique of decoupling differential signals transmitted in a pair of microstrip lines on a printed circuit board (PCB), using dedicated coupler for high speed data transmission monitoring in chip-to-chip interconnections. The coupler used for signal probing is overlayed on the pair of microstrip lines under test, and provides a signal to the next blocks of the measurement system without disturbing transmission in the lines. Starting from the basic configuration obtained in the previous work, we describe a procedure of re-designing the coupler for enhanced directivity so that it is suitable for high-speed data transmission monitoring. The new coupler structure has improved topology based on stepped-impedance resonators with geometry parameters adjusted using numerical optimization techniques. The correctness of the design has been confirmed by the time-domain measurements performed for real chip-to-chip communication signals, using a dedicated measurement system based on Xilinx Virtex-6 FPGA Development Kit. The presented technology can be used for reducing the cost of the product diagnostics by eliminating dedicated measurement connectors, run-time system debugging or reverse engineering.

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Section: Differential Signal Couplermentioning

confidence: 99%

“…The distance s C between the transmission line and the branch of the coupler can be determined using the dependencies below [13] (s c /h) = 2 π cosh…”

Section: Differential Signal Couplermentioning

confidence: 99%

Section: Differential Signal Couplermentioning

confidence: 99%

Section: Coupler Design and Directivity Optimizationmentioning

confidence: 99%

See 2 more Smart Citations

The contact-less method of chip-to-chip high speed data transmission monitoring

Zmuda¹,

Szczepański²,

Kozieł³

et al. 2014

Bulletin of the Polish Academy of Sciences: Technical Sciences

View full text Add to dashboard Cite

show abstract

“…4. The calculation of the even and mode capacitances are given in detail in [23,24]. The interline coupling capacitance is found from…”

Section: Design Equationsmentioning

confidence: 99%

Planar Inductor Design for High Power Applications

Eroğlu

2011

PIER B

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Abstract-Design, simulation, and implementation of low profile microstrip spiral inductors for high power Industrial, Scientific and Medical (ISM) applications at the high frequency (HF-3-30 MHz) range are given for the first time. An accurate analytical model and algorithm have been developed to determine the simplified lumped element equivalent model parameters for spiral inductor and its physical dimensions. Five different spiral inductors are then simulated with a planar electromagnetic simulator using the physical dimensions obtained for the desired inductance values with the analytical method. The implementation method and substrate selection for spiral inductors at the HF range are given in detail for high power applications. The spiral inductors are then constructed on 100 mil Alumina substrate and measured with network analyzer. It is found that analytical, simulation and measurement results are in close agreement and the analytical method and algorithm that have been developed can be used to accurately determine the physical dimensions, and the resonant frequency of the spiral inductor for the desired inductance value.

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Couplers, Combiners, and Dividers

2022

RF/Microwave Engineering and Applications in Energy Systems

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The Complete Design of Microstrip Directional Couplers Using the Synthesis Technique

Cited by 26 publications

References 5 publications

The contact-less method of chip-to-chip high speed data transmission monitoring

The contact-less method of chip-to-chip high speed data transmission monitoring

Planar Inductor Design for High Power Applications

Couplers, Combiners, and Dividers

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