“…The direct covalent linkage (Si-C bond) to the silicon surface provides a well-defined organic monolayer-silicon interface, and the nonpolar character of this strong bond make these monolayers thermally and chemically very robust [Linford, et al, 1995& Sung, et al, 1997. Moreover, because an intervening SiO 2 layer is essentially absent, direct electronic coupling between any organic functionality and the silicon substrate is possible, which provides an opportunity to enhance the device performance compared to SiO 2 -covered electronic devices [Aswal, et al, 2006& Cahen, et al, 2005& Hiremath, et al, 2008& Vilan, et al, 2010. Furthermore, using a semiconductor instead of a metal as a substrate/electrode has the advantage that -depending on the desired electronic properties of the final device -semiconductors with different doping levels and doping types can be used [Boukherroub, 2005& Cahen, et al, 2005.…”