The copper-boron eutectic-unidirectionally solidified

Five decades of research on the development of eutectic as engineering materials

“…The strength of these eutectic varies from 0.6 to 1 GPa while they have relatively low electrical conductivity. In terms of strength to conductivity performance, the eutectic in Cu-B systems provides one of the best performances with a reported strength of ~ 340 MPa with Electrical conductivity of 83% of IACS [89]. mixture of intermetallic ∊ and primary semiconducting Ge in their eutectic microstructure.…”

Cu-based metastable microstructural template and its role in the heat flux application

“…Exploring an immiscible system can be an attractive choice through which fine dispersion can be introduced, and due to its immiscible nature, solute core formation can be avoided, and thus, electron scattering can be minimised. [13][14][15][16][17][18][19][20][21][22][23][24][25][26] Our recent preliminary findings show the potential of immiscibility in Cu-Fe-Si alloy systems where strengthening can be achieved via the evolution of multiscale hierarchical microstructure. [14][15][16] The existing binary miscibility gap in the Cu-Fe system are accessed through the casting route.…”

“…The standard strengthening techniques are precipitation, dispersion of second phases, post-working, rolling, etc. 6–42 All these standard metallurgical techniques impart severe consequences in damaging transport properties due to the insertion of defects-scattering centres. This retrogression in the conductive properties is a design challenge for copper-based alloys.…”

“…This sustained engineering design-oriented challenge can be addressed through the wisdom of microstructural manipulation during the processing of the alloy system. 1–42 Insertion of intermetallic dispersoids may be one of them and it is produced through powder metallurgical route. This production route is costly in terms of processing complexity.…”

“…Exploring an immiscible system can be an attractive choice through which fine dispersion can be introduced, and due to its immiscible nature, solute core formation can be avoided, and thus, electron scattering can be minimised. 13–26…”