The copper sulfide coating on polyacrylonitrile with a chelating agent of ethylenediaminetetraacetic acid by an electroless deposition method and its EMI shielding effectiveness

Abstract

In this study, a copper sulfide layer was instantaneously coated on the polyacrylonitrile (PAN) by an electroless plating method with the reduction agents NaHSO 3 and Na 2 S 2 O 3 Á5H 2 O and a chelating agent (ethylenediaminetetraacetic acid, EDTA). A variety of concentrations of EDTA was added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cu x(x ¼ 1, 2) S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate was residual in PAN substrate would be purged due to the swelling effect by EDTA solution. Then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited successfully by the electroless plating reacted upon EDTA. The swelling degree (S d ) was proposed and evaluated from the FTIR spectra. The relationship between swelling degree of the PAN composite and EDTA concentration (C) is expressed as follows: À15.15C) . On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 to 383 nm when the concentration of EDTA increased from 0.00 to 0.20M. For this reason, the EMI SE of the composites increased from 10-12 dB to 20-23 dB. The GIA-XRD and laser Raman analysis indicated that the deposited layer consisted of CuS and Cu 2 S.

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

“…Chelating agents improve the oxidation of reducing agents, reducing the Cu 2+ reduction rate [97]. The surface morphology was changed from a smaller to a larger grain structure after using an ethylene-di-amine-tetra-acetic acid (EDTA) complexing agent [95,99].…”

Lignocellulose nanocomposite containing copper sulfide

“…Methods for modification of fabrics with electroconductive pigment on the basis of copper sulfide polymer dispersion have been developed; these include new electroconductive polyacrylonitrile (PAN) pigments with coordinative connecting of copper sulfide in the nanostate into the PAN matrix for microwave protection (Lekova 1998) Recently, investigations connected with copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine (Chen 2009) and ethylenediaminetetraacetic acid (Chen 2010) by an electroless deposition method and its EMI shielding effectiveness have received great interest. The literature study showed that the obtaining of new metalcontaining nanocomposites polymer materials with improved electroconductivity and microwave absorption ability is a question of present interest and it is very useful for articles that can provide electromagnetic wave protection.…”

Conductive, antibacterial, and electromagnetic shielding silver‐plated cotton fabrics activated by dopamine

“…Nevertheless, traditional way to realize electroless plating requires sensitization and activation steps by SnCl 2 and PdCl 2 before plating . They are necessary steps to activate the substrate and increase the reduction rate of the plating metal ions .…”