Ternary flame-retardant modified cyanate ester blends (CEPG and CEPA) are formed by combining triazine compounds (TGIC or TAIC) and 9,10-dihydro-9-oxa-10phosphaphenanthrene-10-oxide with cyanate ester resin. The curing behaviors, thermal and mechanical properties, and the flame-retardant properties are investigated. The results show that the CEPG and CEPA blends result in lower curing temperatures and glass transition temperatures than those of neat CE. Both of CEPG and CEPA blends significantly improve the flame-retardant properties of CE resins, and UL-94V-0 rate is achieved for CEPG-1.0 and CEPA-0.5. The dielectric constant and loss of CEPA blends are lower than those of CEPG blend with the same phosphors content, and both of them are lower than those of neat CE. Therefore, the ternary flame-retardant modified cyanate ester blends provide 2 ways for composites of producing printed circuit board with high flame-retardant property and low dielectric constant and loss. KEYWORDS cone calorimeter, cyanate esters, dielectric constant and loss, phosphaphenanthrene, triazine compounds 1 | INTRODUCTION Cyanate ester (CE) exhibits high glass transition temperature, 1 low internal stress, 2 good adhesion, 3 low dielectric constant, 4 low toxicity, and high flame-retardant property, 5 due to the formed steady s-triazine ring by the self-curing of CE group. And owing to those advantages, CE offers several advantages over the commercial use high performance epoxy in aircraft field and electronic application. 6 However, as a thermoset resin, its flammability hinders its application which required high fire safety.As investigated in the previous research, the limiting oxygen index (LOI) of CE (26%) is much higher than that of epoxy resin (22%), but it still failed in UL-94 test. To improve the flame-retardant property of CE, many researchers focused on either combining CE with high thermostable resin such as bismaleimide and benzoxazine or modifying CE with flame-retardants such as halogen-containing, 7 phosphoruscontaining, 8,9 sulfur-containing, 10 and silicon-containing compounds. 11