Binary Fe-Ni alloys with 45-60Ni ͑wt %͒ were evaluated as an interconnect material for intermediate-temperature solid oxide fuel cells ͑SOFCs͒. The oxidation resistance of the Fe-Ni alloys in air improved with increasing Ni content. The thermally grown oxide scale on these alloys generally consisted of a Fe 2 O 3 top layer and a ͑Fe,Ni͒ 3 O 4 spinel inner layer, with the thickness of the Fe 2 O 3 layer decreasing as the Ni content increased. No measurable weight change was observed after isothermal oxidation in Ar + 4%H 2 + 3%H 2 O at 800°C and a metallic surface was maintained. The coefficient of thermal expansion ͑CTE͒ increased with the Ni content in these alloys and the CTE values were similar to those of other cell components. The ͑Fe,Ni͒ 3 O 4 spinel with a composition similar to that thermally grown on the Fe-50Ni alloy exhibited a CTE value close to the alloy substrate, which aids scale spallation resistance for this alloy. The scale area specific resistance of the Fe-Ni alloys was found to be comparable to that of the current interconnect alloys, as a result of high electrical conductivity of the ͑Fe,Ni͒ 3 O 4 spinel. The promise and issue with these Fe-Ni alloys as interconnect materials are highlighted and potential approaches to address the issue are outlined.Some major technical challenges such as cost-effective manufacturing and long-term reliability of the stack must be overcome to advance the solid oxide fuel cell ͑SOFC͒ technology to commercial reality. One of these critical issues is the development of a suitable interconnect material that provides electrical series connection of individual single cells and gas impermeability to separate fuel and oxidant gases. A significant advance in the development of intermediate-temperature SOFCs has been the use of metallic alloys as the interconnect material. 1-10 For SOFC interconnect application, the metallic alloys must develop an electrically conductive, oxidation-resistant oxide scale in the SOFC operating environments. From this point of view, only Cr 2 O 3 -forming alloys are suitable for SOFC interconnect application because Cr 2 O 3 possesses adequate electrical conductivity under SOFC working conditions, whereas the other two protective oxides, SiO 2 and Al 2 O 3 , are electrically insulating. 6,11 However, the Cr 2 O 3 -forming alloys have an inherent weakness that is the formation of volatile Cr͑VI͒ species due to Cr evaporation, especially in the presence of water vapor. The volatile Cr͑VI͒ species might migrate to and poison the cathode, leading to the decreased electrochemical activity of the cathode and subsequent degradation in stack performance over long-term operation. [12][13][14][15][16] Formation of electrically conductive, low Cr-volatility surface oxides on metallic substrates is highly desired to reduce the Cr volatilization of the Cr-containing interconnect alloys. Currently, two approaches are being taken to achieve such a surface oxide layer. The first one is the development of some low Cr-volatility surface coatings such as La...