The Degradation Behavior of Brightener on Dimensionally Stable Anodes during the Copper Electrodeposition

Abstract

This study shows the first work that in the copper electroplating bath containing brighteners, the degradation and lifetime of brighteners are mainly determined by the mixed metal oxide (MMO) coating on the anode. We demonstrate that the depolarizing ability and lifetime of bis-3-sulfopropyl-disulfide (SPS), a typical brightener in the copper electroplating bath, are strongly affected by the oxidative activity of the anode. Here, the commercially available IrO 2 -based and Ta 2 O 5 -based dimensionally stable anodes (DSA) are employed in the Cu plating, and the oxidation rate of SPS during the deposition is analyzed. The results reveal the prolonged depolarizing ability and lifetime of SPS in the plating bath when the relatively inert anode, Ta 2 O 5 -DSA, is used. The degradation rate of brighteners can be quantified by the voltammetric stripping method and consequently, the variation in the brighteners activity during electrodeposition can be precisely tracked to ensure their functions. Moreover, the inert anode is highly recommended to prolong the function and lifetime of SPS, which is cost-effective and beneficial for circumventing the bath aging issue.

Effect of Reduced Graphene Oxide on the Ta2O5-IrO2 Electrocatalyst for Water Splitting

“…29,30 The most common concerns for such electrodes are their anodic stability and service life. 31,32 Typically DSAs are composed of a thin active coating that is deposited onto a base metal substrate. 33 Previous research has indicated that DSAs consisting of a noble metal or metal oxide tend to achieve catalytic activity for OER when a second metal or metal oxide is added, to improve the strength of the electrochemical stability of the catalytic coating.…”

Detection of Organic Additives in Copper Plating Bath Using Voltammetric Methods That Involve a Screen-printed Nano-Au Electrode

“…The organic additives are added to the plating solution at a low concentration, which is usually calculated in parts per million (ppm). It is necessary to maintain a low concentration of organic additives to achieve the desired deposition behavior and the required metal properties [12][13][14][15].…”