The Design and Manufacture of a Light Emitting Diode Package for General Lighting

Abstract

Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies.The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design.v ACKNOWLEDGEMENTS

A Review of Prognostic Techniques for High-Power White LEDs

“…Commonly, the high-power LED devices as microelectronics are created as wire-bond or flip-chip packages. For wire-bond and flip-chip interconnection technologies, the optical limitation of LEDs requires unique methods of transferring both heat and electrical signals through the bottom side of the package only, while leaving the top optical side exposed [35]. As discussed above, thermomechanical fatigue is a major issue of wire-bond and flip-chip packaged LEDs where the LED chip is mounted to the circuit board by a solder joint [2] [3].…”