2007
DOI: 10.1109/tnano.2007.894355
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The Design of Dual Work Function CMOS Transistors and Circuits Using Silicon Nanowire Technology

Abstract: This exploratory study on vertical, undoped silicon nanowire transistors shows less power dissipation with respect to the bulk and SOI MOS transistors while yielding comparable performance. The design cycle starts with determining individual metal gate work functions for each nMOS and pMOS transistor as a function of wire radius to produce a 300 mV threshold voltage. Wire radius and effective channel length are both varied until a common body geometry is determined for both nMOS and pMOS transistors to limit O… Show more

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Cited by 16 publications
(8 citation statements)
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“…signal characterization of a 50 nm gate FinFET measurement has predicted the maximum oscillation frequency of 250 GHz with an optimized fabrication process [22]. Among the nanoscale multiple-gate devices, the silicon-based nanowire FETs have the ultimate gate structures and become potential candidates for next-generation high-speed and high-power electronic devices [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27]. Besides the perfect channel controllability resulting from the nature of the gate-all-around channel [19][20][21], the nanowire FETs may tolerate having a thicker silicon fin, compared with double-and triplegate FinFETs according to the manufacturability point of view [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…signal characterization of a 50 nm gate FinFET measurement has predicted the maximum oscillation frequency of 250 GHz with an optimized fabrication process [22]. Among the nanoscale multiple-gate devices, the silicon-based nanowire FETs have the ultimate gate structures and become potential candidates for next-generation high-speed and high-power electronic devices [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27]. Besides the perfect channel controllability resulting from the nature of the gate-all-around channel [19][20][21], the nanowire FETs may tolerate having a thicker silicon fin, compared with double-and triplegate FinFETs according to the manufacturability point of view [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…To build the CMOS configuration it is easier to use the top-down process technology for implementation. PFET and NFET conductance matching by width, like CMOS design, is not possible for single-diameter NW, and two p-type wires for one n type [6] or different diameters for p-type and n-type NWFETs are proposed [7].…”
Section: Inverter and Logic Gate Configurationmentioning
confidence: 99%
“…Therefore, alternative silicon compatible transistor devices such as silicon on insulator (SOI) MOSFETs, FinFETs, and nanotube FETs have been investigated for improved performance [2].…”
Section: Introductionmentioning
confidence: 99%