The desirable dielectric properties and high thermal conductivity of epoxy composites with the cobweb-structured SiCnw–SiO2–NH2 hybrids

Wang, Zhengdong; Wang, Xiaozhuo; Zhao, Nannan; He, Jieyu; Wang, Silong; Wu, Guanglei

doi:10.1007/s10854-021-06543-9

Cited by 24 publications

(10 citation statements)

References 37 publications

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“…The main function of TIMs is to fill the gap between the microelectronic device and the radiator fin so that the interface thermal resistance will be reduced [ 5 ]. Polymers, such as epoxy resin or silicone rubber, are commonly used as TIMs due to their superior adhesiveness, thermal stability and electrical insulation [ 6 , 7 ]. However, their low TC values (below 0.3 W/m·K) cannot satisfy the needs of microelectronic devices.…”

Section: Introductionmentioning

confidence: 99%

“…One strategy is to build a three-dimensional network skeleton. In this structure, fillers can form interconnected thermal conductivity paths, giving rise to a reduction in interface thermal resistance in polymer composites [ 6 , 21 , 22 , 23 ]. For instance, Chen et al [ 24 ] used nanocellulose as the connecting intermediate to construct a three-dimensional network framework with interconnected BNNS and then infiltrated the epoxy resin solution into the framework, thus obtaining a nanocomposite with a thermal conductivity of 3.13 W/m·K.…”

Section: Introductionmentioning

confidence: 99%

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The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

et al. 2022

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Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

et al. 2022

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“…Garrett [ 3 ], of the technical department of Akrometrix, used Timoshenko’s biomaterial warpage theory [ 1 ] to derive the variables of warpage after an IC molding process: material properties (Young’s modulus and CTE), mold compound, substrate thickness, and temperature of the molding process. Wu et al [ 4 , 5 ] discussed how the material properties of epoxy composites affected the performance of electronic devices and discovered the desirable dielectric and thermal properties for their design; they also studied the microwave absorption for nanorod and spinel structures [ 6 , 7 ]. Although some studies have analyzed package warpage theoretically, they simplified the structure into only the mold compound and substrate.…”

Section: Introductionmentioning

confidence: 99%

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

Chuang

Chen

2022

Materials

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This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be less than 8%. Taguchi analysis was employed to identify the key factors affecting strip warpage, which were discovered to be die thickness and substrate thickness, followed by mold compound thickness and molding temperature. Although a greater die thickness and mold compound thickness reduce the strip warpage, they also substantially increase the overall strip thickness. To overcome this problem, design criteria are proposed, with the neutral axis of the strip structure located on the bump. The results obtained using the criteria revealed that the strip warpage and overall strip thickness are effectively reduced. In summary, the proposed model can be used to evaluate the effect of structural design and process parameters on strip warpage and can provide strip design guidelines for reducing the amount of strip warpage and meeting the requirements for light, thin, and short chips on the production line. In addition, the proposed guidelines can accelerate the product development cycle and improve product quality with reduced development costs.

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“…In turn, hard inserts are made of rigid panels or plates. Hard ballistic armors may be constructed from compressed laminate sheets, ceramics, metals, or hybrid composites that incorporate more than one material [ 1 , 4 , 5 , 6 , 7 ]. Hard armors are designed to protect against greater threats (with a projectile velocity of more than 500 m/s) than soft armor [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

Fragment-Resistant Property Optimization within Ballistic Inserts Obtained on the Basis of Para-Aramid Materials

et al. 2022

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A high protection level without an excessive weight is a basic assumption in the design of modern armors and protection systems. Optimizing armors is a task of development of the utmost importance, and is the subject of the work contained within this article. Optimization of ballistic inserts was carried out using multicriterial analysis (MCA), which enables the selection of the optimal composition, taking into account properties such as ballistic resistance, physicomechanical, and/or functional properties. For this purpose, various types of composite systems were produced and tested in terms of their fragment-resistant properties according to STANAG 2920 and the composite areal density of different ballistic inserts: Soft inserts made of Twaron® para-aramid sheets, hard ballistic inserts made of multilayer hot-pressed preimpregnated sheets, and hybrid hard ballistic inserts prepared on the basis of multilayer hot-pressed preimpregnated sheets and ceramics. The application of MCA and performance of experimental fragment resistance tests for a wide spectrum of para-aramid inserts are part of the novelty of this work. The obtained test results showed that depending on the composition of the composite system, we could obtain a wide range of fragmentation resistance in the range of 300 to >1800 m/s, which depended on the areal density and type of composite system used. The results also confirmed that MCA is a good computational tool to select the optimal design of para-aramid ballistic inserts.

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The desirable dielectric properties and high thermal conductivity of epoxy composites with the cobweb-structured SiCnw–SiO2–NH2 hybrids

Cited by 24 publications

References 37 publications

The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

Fragment-Resistant Property Optimization within Ballistic Inserts Obtained on the Basis of Para-Aramid Materials

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