The detection of flaws in optoelectronic systems

Budai, B. T.; Porodnov, V. T.; Myakutina, I. V.; Kasatkin, N. V.

doi:10.1134/s1061830912070029

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2013

2016

Publication Types

Select...

Article5

Relationship

Self Cite1

Independent4

Authors

Journals

Cited by 5 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Failures most frequently occur in instruments that operate under conditions of elevated temperatures, vibrations, etc., for example, in instruments for controlling leaks from gas and oil pipelines using opticalelectronic systems (OESs) [1], gauges for monitoring the thickness of produced rolled sheets [2], etc. Some developers are inclined to consider that frequent failures occur due to severe thermal and vibration conditions that are caused by various factors, including internal thermal and vibration operating condi tions of instruments [2,3].…”

Section: Introductionmentioning

confidence: 99%

The reliability of soldered joints produced at a low temperature

Shtennikov

Budai

2013

Russ J Nondestruct Test

Self Cite

View full text Add to dashboard Cite

Abstract-Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints.

show abstract

Section: Introductionmentioning

confidence: 99%