The Deterioration Characteristics and Mechanism of Polishing Pads in Chemical Mechanical Polishing of Fused Silica

Kang, Chengxi; Guo, Dan; Zhang, Xin; Zou, Chunli; Pan, Guoshun

doi:10.1149/2.0051901jss

ECS J. Solid State Sci. Technol.

2019

DOI: 10.1149/2.0051901jss

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The Deterioration Characteristics and Mechanism of Polishing Pads in Chemical Mechanical Polishing of Fused Silica

Chengxi Kang

Dan Guo

Xin Zhang

et al.

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Cited by 5 publications

(1 citation statement)

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“…In addition, pad surface tends to glaze during CMP due to the complex interaction among polishing pad, workpiece and slurry. 29,30 Lee et al 20 suggested that RCA continued to decrease with glazing of pad surface during continuous polishing. Jeong et al 31 further indicated that abrasive particles trapped in the contact area not only removed regions of protrusion on the workpiece, but also wore pad asperities, which led to the increase of RCA.…”

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Effect of Viscoelastic Characteristics on the Real Contact Area of Polishing Pad Surface

Hou,

Di,

Wang

et al. 2024

ECS J. Solid State Sci. Technol.

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Real contact area (RCA) between polishing pad and workpiece surface is one of the most important parameters indicating the mechanical action strength of chemical mechanical polishing (CMP), which has a dominated effect on the material removal. However, the effect of pad viscoelastic characteristics on RCA is not clear. In this study, a contact status measurement device that can apply cyclic load and record contact images is developed to study the viscoelastic behavior of the pad and its influence on RCA. The results show that when the pad undergoes cyclic compression load during CMP, the pad asperity layer gradually accumulates viscoelastic deformation and the RCA increases obviously, which can be mostly recovered after a long time. In particular, the accumulation and recovery of viscoelastic deformation lead to a significant change of the relationship between RCA and pressure, from linear to nonlinear and then to linear. Furthermore, an RCA model is established based on the viscoelastic constitutive model of pad and the mathematical relationship between RCA and pad deformation to explain the influence of pad viscoelastic behavior on RCA. This study is expected to provide new insights into RCA, and to give support for predictive control of the material removal during CMP.

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confidence: 99%

Effect of Viscoelastic Characteristics on the Real Contact Area of Polishing Pad Surface

Hou,

Di,

Wang

et al. 2024

ECS J. Solid State Sci. Technol.

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The Cycle Characteristics of Slurries in Chemical Mechanical Polishing (CMP) of Fused Silica

et al. 2020

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The role of the polishing slurry is crucial in chemical mechanical polishing (CMP) of fused silica (FS). Researching on cycle characteristics of slurry contributes to exploring the deterioration mechanism and prolonging the service time. In this paper, cycle characteristics of colloidal silica slurry and ceria slurry applied in CMP of FS were investigated when the two slurries were recycled for 53 and 42 hours, respectively. The changes of the material removal rate (MRR) and surface roughness (Rq) of FS were analyzed, and the material removal mechanism of both slurries had been discussed. Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were employed to interpret the changes of the slurry characteristics. The results indicate that with the increase of recycling time, decrease of pH value and increase of solid content are two common factors which affected MRR improvement for both two kinds of slurries. For colloidal silica slurry, the Rq value fluctuates probably due to unchanged sizes and deformed shapes of SiO 2. For ceria slurry, the Rq value increases probably due to the size reduction of ceria particles.

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Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing

Chen

Luo

Zhou

et al. 2023

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The Deterioration Characteristics and Mechanism of Polishing Pads in Chemical Mechanical Polishing of Fused Silica

Cited by 5 publications

References 22 publications

Effect of Viscoelastic Characteristics on the Real Contact Area of Polishing Pad Surface

Effect of Viscoelastic Characteristics on the Real Contact Area of Polishing Pad Surface

The Cycle Characteristics of Slurries in Chemical Mechanical Polishing (CMP) of Fused Silica

Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing

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