The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations

Li, Hua; Chan, Y.C.; Wu, Yipeng; Wu, Bingyang

doi:10.1016/j.jhazmat.2008.07.150

Cited by 56 publications

(26 citation statements)

References 23 publications

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“…Over the same period, the environmental pressures from abroad also caused shockwaves to the domestic manufacturing industry. As an example, the WEEE and RoHS directives issued by European Union limited the use of hazardous substances in the production of importing electronic and electrical products [44]. Thus, it is inferred that the rapid growth in 2005 and 2006 has much to do with the issues of new policies.…”

Section: Discussionmentioning

confidence: 99%

Measuring Green Growth Efficiency for Chinese Manufacturing Industries

Appolloni

et al. 2017

Sustainability

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Abstract:As a pillar industry in supporting Chinese economy, Chinese manufacturing industry consumes a large amount of energy and causes serious environmental pollutants. Better understanding the greening level of manufacturing industry is important to promote its green growth. Hence first this study, measures the green growth efficiency for Chinese manufacturing industries by applying the EBM measuring model; second, to better understand the differences and similarity in green growth among those industries, this study categorizes those industries into different types by using cluster analysis. The result shows that within the past nine years, green growth efficiency value for Chinese manufacturing industries rises steadily year by year, and Chinese manufacturing industries have huge promotion potentials in resource saving and environment pollutant reduction. And the characteristics of each different type are analyzed. Finally, policies and suggestions are put forward to promote the green growth of manufacturing industries in China. This study objectively evaluates the green growth level of Chinese manufacturing industry, which is helpful to understand the status quo and also explore green growth path for Chinese manufacturing industries.

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Section: Discussionmentioning

confidence: 99%

Measuring Green Growth Efficiency for Chinese Manufacturing Industries

Appolloni

et al. 2017

Sustainability

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“…50,55 e cromo hexavalente (pigmentos, plastificantes). 56,57 As contaminações ambientais diretamente devidas ao descarte dos resíduos eletroeletrônicos estão mais relacionadas à forma incorreta como ele é manuseado em países da Ásia ou África (descarte das sobras desse lixo no ambiente) do que ao comportamento dele em si descartado diretamente no ambiente, conforme relatado em vídeos e reportagens publicadas pela mídia e por Organizações Não Governamentais (ONGs). 58 Em áreas de reciclagem informal na China, Gana e Nigéria, solos e plantas se acham altamente contaminados por metais e polímeros tóxicos e retardantes de chama bromados, os quais acumulam-se e causando até mesmo efeitos genotóxicos (danos ao DNA) às plantas.…”

Section: Impactos Ambientais Dos Resíduos Eletroeletrônicos (Ree)unclassified

Waste Electrical and Electronic Equipment: The Anthropocene Knocks on Our Door

Afonso

2018

Rev. Virtual Quim.

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This review describes the technological, environmental, socio-cultural, economical and health challenges due to the waste electrical and electronic equipment. The rate of production of this waste has reached scary levels in the last years, and the level of perception of the populations facing the challenges imposed for their management greatly varies from one country to another. Solutions for waste electrical and electronic equipment are extremely complex, from the establishment of an effective reverse logistics of used products and reverse manufacturing protocols, to the proposal of technologies capable of processing the components of the various electrical and electronic products. Printed circuit boards, cathode ray tubes and liquid crystal displays are the most difficult components to recycle due to their multi-component nature: although they contain high-added value elements in much larger amounts than those of primary sources, they also present metallic components and organic compounds that are highly toxic to health and lead to environmental impacts. Brazil has begun to pay attention to the problem of e-waste relatively recently. Despite ongoing initiatives, the country still has a long way to go until the establishment of a management system that covers all its stages and peculiarities, such as its territorial extension. Waste electrical and electronic equipment is one of the most eloquent symbols of Anthropocene.

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“…However, the replacement induced thermal challenge in reflow process due to the increased melting temperature [4]. The triggered thermal aggregation and overheating lead to excessive growth of intermetallic compounds (IMC) which further deteriorates the reliability issue of the interconnect.…”

Section: Introductionmentioning

confidence: 99%

Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection

Chan

2014

2014 15th International Conference on Electronic Packaging Technology

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Lead-free solder alloy is popular in electronic industry due to its environmental friendly characteristic. However, the interfacial reaction faces the thermal challenge caused by the increased melting temperature of lead-free solder alloy. In the present work, a composite Ni-P-ZrO 2 (15 at.% of P) layer was developed by electroless plating as novel under bump metallization (UBM). In order to homogeneously disperse ZrO 2 nanoparticle in the Ni-P layer, ultrasonic vibration and magnetic stirring were adopted. The interfacial reaction between electroless Ni-P-ZrO 2 layer and lead-free solder alloy was systematically investigated by scanning electronic microscopy (SEM) with EDX. The microstructure shows Ni 3 Sn 4 layers growth at a lower rate in solder/Ni-P-ZrO 2 joint compared with solder/Ni-P joint. The top-view intermetallic compounds (IMCs) layer in ZrO 2 doped sample demonstrated a refined grain size. The consumption rate of amorphous UBM to crystalline Ni 3 P phase is limited in solder/Ni-P-ZrO 2 joint due to the ZrO 2 nanoparticle addition. Moreover, the ZrO 2 nanoparticle doped sample consistently demonstrated higher shear strength than plain solder joint as a function of the number of reflow cycles. Therefore, Ni-P-ZrO 2 UBM not only suppress the excess growths of IMC layer but also helps to reinforce the mechanical property of solder joint, thus improve the reliability of the interconnect.

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The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations

Cited by 56 publications

References 23 publications

Measuring Green Growth Efficiency for Chinese Manufacturing Industries

Measuring Green Growth Efficiency for Chinese Manufacturing Industries

Waste Electrical and Electronic Equipment: The Anthropocene Knocks on Our Door

Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection

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