The development of a low temperature cure modified epoxy resin system for aerospace composites

Carter, J.T.; Emmerson, G.T.; Faro, Carmelo Lo; McGrail, P.T.; Moore, Donald R.

doi:10.1016/s1359-835x(02)00115-x

Cited by 33 publications

(20 citation statements)

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“…3. These particular voids are likely the result of toughening mechanisms in the adhesive (such as those reported in [33]) rather than a result of sample preparation.…”

Section: Sem Analysis Of Fracture Surfacesmentioning

confidence: 94%

Mixed-mode fracture toughness of co-cured and secondary bonded composite joints

Mohan

Ivanković

2015

Engineering Fracture Mechanics

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“…3. These particular voids are likely the result of toughening mechanisms in the adhesive (such as those reported in [33]) rather than a result of sample preparation.…”

Section: Sem Analysis Of Fracture Surfacesmentioning

confidence: 94%

Mixed-mode fracture toughness of co-cured and secondary bonded composite joints

Mohan

Ivanković

2015

Engineering Fracture Mechanics

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“…New types of binders and modifiers are being designed now along with methods for their incorporation into the matrix that are optimized for a specific manufacturing process of PCM production, including modern out-of-autoclave technologies. For example, the authors of [130] described an epoxy system with a decreased curing temperature in which a modifier based on a polyethersulfone copolymer is used. Modifiers of various kinds may be used simultaneously (e.g., thermoplastic and inorganic nanoparticles [131]), and this combination may yield a synergistic effect.…”

Section: Discussionmentioning

confidence: 99%

Improvement of the impact and crack resistance of epoxy thermosets and thermoset-based composites with the use of thermoplastics as modifiers

2016

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Main methods for the modification of epoxy composites that aim to increase their impact and crack resistances are considered with the main attention focused on modification with the use of thermally stable thermoplastics as additives. The influence of various factors (the modifier-matrix chemical bond and the morphology and molecular weight of the modifier) on the physicomechanical characteristics of the composites is discussed. New approaches to the toughening of polymeric composite materials based on epoxy thermosets that involve the use of modified binders or the introduction of a modifier between layers of the composite prepreg are advanced.

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“…As composite materials often require curing, a process that can be achieved by pressure and temperature or both of these features. It is vital to understand ways of reducing the chance of curing causing adverse effects on the material during forming operations [16,17].…”

Section: Materials Requirementsmentioning

confidence: 99%