2015
DOI: 10.1007/s11837-015-1355-2
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The Development of Molecular-Based Materials for Electrical and Electronic Applications

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Cited by 17 publications
(8 citation statements)
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“…Also, the density, strength and hardness of Al6061-SiC and Al7075-Al2O3 were compared at 2, 4 and 6wt% addition of reinforcements and it was reported that the experimental densities of the composites were similar to those of the theoretical densities, however, the addition of Al2O3 into the Al matrix resulted to improved strength, hardness and density slightly higher than the improvement obtained with SiC addition; the addition of harder reinforcements also improved the wear resistance of the composites over that of the unreinforced Al alloy [6]. Low density, low coefficient of thermal expansion, good mechanical strength and hardness, as well as good thermal and electrical conductivities are some of the properties that make AlMMCs functional electronic packaging and thermal management materials especially for weight sensitive applications over conventional copper tungsten (CuW) and copper molybdenum alloys [1,7]. Some works have recently been reported on the utilization of agricultural wastes as filler for Al-MMCs [3,[8][9][10].…”
Section: Introductionmentioning
confidence: 94%
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“…Also, the density, strength and hardness of Al6061-SiC and Al7075-Al2O3 were compared at 2, 4 and 6wt% addition of reinforcements and it was reported that the experimental densities of the composites were similar to those of the theoretical densities, however, the addition of Al2O3 into the Al matrix resulted to improved strength, hardness and density slightly higher than the improvement obtained with SiC addition; the addition of harder reinforcements also improved the wear resistance of the composites over that of the unreinforced Al alloy [6]. Low density, low coefficient of thermal expansion, good mechanical strength and hardness, as well as good thermal and electrical conductivities are some of the properties that make AlMMCs functional electronic packaging and thermal management materials especially for weight sensitive applications over conventional copper tungsten (CuW) and copper molybdenum alloys [1,7]. Some works have recently been reported on the utilization of agricultural wastes as filler for Al-MMCs [3,[8][9][10].…”
Section: Introductionmentioning
confidence: 94%
“…Al-MMCs are engineered materials made by incorporating non-metallic reinforcement(s) into aluminium or its alloy so as to tailor the properties such as strength, hardness, stiffness, electrical and thermal conductivity as well as other properties of the material. Al-MMCs offer high strength to weight ratio and high stiffness to weight ratio [1]. In the composite, the good properties of the metal such as light weight, high ductility, electrical and thermal conductivities are combined with the properties of the reinforcement such as low coefficient of thermal expansion, high stiffness, and strength and abrasion resistance to produce material with desired properties.…”
Section: Introductionmentioning
confidence: 99%
“…Table 1 shows the weight percentage of FeNb particles in materials. Electromagnetic stirring was done with 500 revolutions per minute for about 5 min to avoid agglomeration and uniform dispersion of FeNb particles [2]. Then after raising the furnace temperature to 750 °C, subsequently the molten liquid metal was poured into the preheated metal mould.…”
Section: Methodsmentioning
confidence: 99%
“…However, they suffer from shortcomings like poor tribological properties, thermal instability and low tensile strength [1]. To mitigate these shortcomings, many researchers incorporated hard ceramic particles into aluminium alloys leading to Aluminium Metal Matrix Composites (AMMCs) [2,3]. The replacement of conventional materials with metal matrix composites (MMCs) as a structural engineering material is widespread in automobile, aerospace, military and marine sectors [4][5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…The result is attributed to the presence of ceramic silicon carbide, a poor electrical and thermal conductor. However, the low material density of AlSiC (3 g/cm 3 ) makes it ideal for weight sensitive applications such as portable devices over traditional thermal management materials like copper molybdenum (CuMo, 10 g/cm 3 ) and copper tungsten (CuW, 16 g/cm 3 ) [14]. Also, the addition of silicon carbide molecules, a ceramic powder, improved thermal stability of AlSiC material when compared to the monolithic aluminium.…”
Section: Ajmc-p49mentioning
confidence: 99%