Polyimides are a class of high performance polymers that contain an imide group, defined as an
sp
3
nitrogen bonded to two adjacent carbonyls. This imide structure is most commonly found as part of a five‐ or six‐membered ring. Polyimides are noted for their mechanical properties, chemical resistance, and dielectric strength. They exist as thermoplastics and thermosets. Polyimides are used as hot melt adhesives, matrix resins for composites, dielectric films, photoimageable coatings, flex circuits, foams, wire insulation, thin‐walled tubing, molding resins, and high performance bushings and seals. Products that compete with polyimides for niche applications include aerospace epoxies (Dow, Ciba, and Shell), cyanate resins (Dow), polysulfones (Solvay), filled polycarbonates and polyesters (Dow, Amoco, and GE), polybenzimidazoles (Hoechst‐Celanese), and some high
T
g
filled phenolics. Although polyimides command a premium price, their versatility, reliability, and demonstrated performance make them suitable for use in high performance applications where failure and replacement costs are high.