1992
DOI: 10.1016/0022-0248(92)90753-6
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The diffusion of copper in cadmium telluride

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Cited by 65 publications
(39 citation statements)
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“…For fast diffusing species such as Cu and Ag the activation energy is less than 0.7 eV, implying that interstitial atomic movement is the dominant diffusion mechanism. Results of the diffusion of Cu in CdTe single crystals study in the temperature range 473-673 K using a radiotracer sectioning technique led to conclusion in [27] that complex diffusion occurred via a defect of the form (Cu i Cd v )'. The major portion of the activation energy (0.57 eV) for the diffusion was taken up in the formation of the defect rather than in its migration through the lattice.…”
Section: Diffusion Of Isovalent and Ib Group Fast Impuritiesmentioning
confidence: 98%
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“…For fast diffusing species such as Cu and Ag the activation energy is less than 0.7 eV, implying that interstitial atomic movement is the dominant diffusion mechanism. Results of the diffusion of Cu in CdTe single crystals study in the temperature range 473-673 K using a radiotracer sectioning technique led to conclusion in [27] that complex diffusion occurred via a defect of the form (Cu i Cd v )'. The major portion of the activation energy (0.57 eV) for the diffusion was taken up in the formation of the defect rather than in its migration through the lattice.…”
Section: Diffusion Of Isovalent and Ib Group Fast Impuritiesmentioning
confidence: 98%
“…A much faster diffusion mechanism (%100 times faster), which did not show any consistent behaviour with temperature, was also observed in the diffusion profiles. [27] For slow diffusing species like Au, E a reaches 2 eV, and vacancy diffusion is probably the dominant mechanism.…”
Section: Diffusion Of Isovalent and Ib Group Fast Impuritiesmentioning
confidence: 99%
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“…Moreover, Cu can diffuse rapidly in semiconductors, affecting the stability of solar cells. [18][19][20][21] Recent combined experimental and theoretical studies 22 show that a Cd-rich growth condition is required to achieve long minority-carrier lifetime ($20 ns) because it can suppress the Te Cd antisites. This suggests that substitutionally doping As or P on the Te site under Cd-rich growth conditions should simultaneously increase the hole density and minority carrier lifetime.…”
mentioning
confidence: 99%
“…13,14 Cu i + was suggested to be mobile at room temperature, and this is consistent with the cell stressing tests carried out at room temperature in our laboratory. [12][13][14][15] It was reported that Cu doping of CdTe absorber layer could lead to Cu diffusion to the CdTe/CdS interface. 16 In a solar cell structure, accumulation of Cu near the CdS/CdTe junction interface would have profound influence on the cell performance.…”
Section: Introductionmentioning
confidence: 99%