The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C

Verification of Equation for Evaluating Dislocation Density during Steady-state Creep of Metals

“…Relation between stress and the steady state strain rate or flow rate for pure Cu (Raj et al, 1989). Total dislocation densities obtained by Staker and Holt (solid triangle) (Staker et al, 1972) for pure Cu strained to 0.1 under tension and by obtained Hasegawa et al (1973) (solid circle) for Cu-0.2Al alloy in a steady-state creep employing TEM are shown. The values of calculated using the dislocation densities and the parameter constants for Grs.…”

“…II and III are also shown. Staker and Holt (1972) conducted tensile tests of pure Cu at temperatures at 500 to 700 ℃ and measured the total dislocation densities of specimens strained to = 0.1 employing TEM. Hasegawa, Karashima, and Ikeuchi (1973) observed the total dislocation density of Cu-0.2Al alloy that crept in a steady state at 480 ℃ employing TEM.…”

“…The pure Cu that Staker et al (1972) used was oxygen-free high-conductivity (OFHC) Cu with rather high impurity (e.g., P: 1000 to 10 000 ppm) and had fine grains with an average diameter of 0.05 mm. Meanwhile, the specimen of Hasegawa et al (1973) was a Cu-0.24Al alloy melted in the laboratory using ultra-high-purity raw materials and had coarse grains.…”

Cyclic deformation behavior of copper single crystals with dispersed SiO2 particles

“…7 that dislocation walls develop to form fine cell structures with an increasing number of cycles. The resulting fine cell structure is indicative of the strengthening of the metal matrix [6].…”

Development of nanocrystalline structure in Cu during friction stir processing (FSP)

“…2a, the location closed to the pin-stir zone interface. Based on the Holt's prediction [15], the relationship between the DC size (d DC ) and the applied shear stress ( ) for OFHC copper is [16]:…”