2012 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC) 2012
DOI: 10.1109/nssmic.2012.6551176
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The DSSC pixel readout ASIC with amplitude digitization and local storage for DEPFET sensor matrices at the European XFEL

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Cited by 22 publications
(14 citation statements)
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“…These scattering patterns were recorded by a DSSC detector 48,49 1.44 m downstream of the sample. The detector had 1024 × 1024 pixels, arranged in 16 ladders of 128 × 512 hexagonal pixels with a cartesian spacing of 236 µm and 204 µm in x and y direction, respectively 50 . We applied a mask to remove parasitic infrared light and defective pixels from the recorded data, as discussed in detail in Supplementary Information S.6.…”
Section: Discussionmentioning
confidence: 99%
“…These scattering patterns were recorded by a DSSC detector 48,49 1.44 m downstream of the sample. The detector had 1024 × 1024 pixels, arranged in 16 ladders of 128 × 512 hexagonal pixels with a cartesian spacing of 236 µm and 204 µm in x and y direction, respectively 50 . We applied a mask to remove parasitic infrared light and defective pixels from the recorded data, as discussed in detail in Supplementary Information S.6.…”
Section: Discussionmentioning
confidence: 99%
“…MM2 architecture, design, and test results are reported in [3]. Detailed characterizations of individual ASIC building blocks, namely of the analog front-end and of the ADC, can be found in [5] and [10], respectively.…”
Section: Dssc Prototype Set-upmentioning
confidence: 99%
“…At the time of writing this conference contribution, the MM3 prototype ASIC, the successor to the MM2 ASIC prototype that we used for the presented results, is being tested and verified (first results can be found in [3]). We intend to repeat the NLSR calibration with this new ASIC prototype, which offers multiple advantages over the current MM2 chip.…”
Section: Sum Mary and Prospectsmentioning
confidence: 99%
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“…The maximum focal plane 1 fill-factor is 85% with the present mechanical design. Each sensor is bump-bonded to eight mixed signal readout ASICs [13]. The ASICs are designed using 130-nm IBM CMOS technology and provide full parallel readout of 64 × 64 sensor pixels.…”
Section: Introductionmentioning
confidence: 99%