2001
DOI: 10.1063/1.1352563
|View full text |Cite
|
Sign up to set email alerts
|

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

Abstract: Real-time measurements of stress evolution during the deposition of VolmerWeber thin films reveal a complex interplay between mechanisms for stress generation and stress relaxation. We observed a generic stress evolution from compressive to tensile, then back to compressive stress as the film thickened, in amorphous and polycrystalline Ge and Si, as well as in polycrystall;ne Ag, Al, and Ti. Direct measurements of stress relaxation during growth interrupts demonstrate that the generic behavior can occur even i… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

18
210
1
2

Year Published

2002
2002
2024
2024

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 343 publications
(231 citation statements)
references
References 37 publications
18
210
1
2
Order By: Relevance
“…When depositing Fe on top of MgO, first compressive stress is observed, which then tends to tensile stress and again to compressive stress. The compressive-to-tensile transition is a clear indication for island growth in these laser deposited multilayers [15,16], as expected from the differences in the surface energies of Fe and MgO, and for instance also observed in evaporated films by Floro et al [17]. The complex behavior of the stress thickness curve can be explained as follows.…”
Section: Resultssupporting
confidence: 68%
“…When depositing Fe on top of MgO, first compressive stress is observed, which then tends to tensile stress and again to compressive stress. The compressive-to-tensile transition is a clear indication for island growth in these laser deposited multilayers [15,16], as expected from the differences in the surface energies of Fe and MgO, and for instance also observed in evaporated films by Floro et al [17]. The complex behavior of the stress thickness curve can be explained as follows.…”
Section: Resultssupporting
confidence: 68%
“…During the deposition of polycrystalline metal thin films grown according to the Volmer-Weber mode (VW), the evolution of the growth stress (which has its origin in the interaction between grains) exhibits several transitions (compressive → tensile → compressive) as the film thickness increases 1 or the grain size raises for postdeposition annealing. 1,2 These transitions have been correlated with the inherent stages to VW-type growth: (i) Nucleation and grain growth, (ii) grain coalescence and percolation, and (iii) closure and film growth.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 These transitions have been correlated with the inherent stages to VW-type growth: (i) Nucleation and grain growth, (ii) grain coalescence and percolation, and (iii) closure and film growth. It is widely admitted that during stages (i) and (ii) the surface tension and the cohesive forces between close grains generate compressive and tensile stresses, respectively, with significant changes in the film morphology.…”
Section: Introductionmentioning
confidence: 99%
“…As the thickness is increased to 290 nm the average peak-to-trough remains relatively low at ~ 50 nm with a mono-modal height distribution. This suggests that the Volmer-Weber [22] growth mechanism is occurring at the lower thicknesses, resulting in island formation.…”
Section: Growth Mechanismmentioning
confidence: 96%