“…Most commonly, the modeling is based on an equivalent circuit of the thermal resistance, which includes those of the TIM and of the interface between the TIM and each of the two proximate surfaces. 2,[18][19][20][21] The thermal resistance of this interface has been modeled by consideration of the degree of filling of the valleys in the surface topography. 2,18,19 However, the complexity of the combination of geometric, thermal, mechanical, and material factors calls for finite element modeling, which is the method used in this work.…”