The effect of Al to high-temperature deformation mechanisms and processing maps of Al0.5CoCrFeMnNi high entropy alloy

Kim, Woo Jin; Jeong, Heon; Park, H.K.; Park, K.; Na, Tae‐Wook; Choi, Eunsoo

doi:10.1016/j.jallcom.2019.06.099

Cited by 48 publications

(11 citation statements)

References 63 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In particular, the domain of dynamic recrystallization (DRX) is important, since this process reconstitutes the microstructure and enhances the hot workability. In literature, there are only few studies on the development of processing maps of HEAs, such as CoCrFeMnNi [29], Al 0.5 CoCrFeMnNi [30], Al 0.7 CoCrFeNi [18] and FeCrCuNi 2 Mn 2 [28], illustrating their hot workability and constitutive models. However, these studies offer only a limited in-depth analysis in terms of the evolution of microstructures without encompassing all the deterministic domains of the processing maps.…”

Section: Introductionmentioning

confidence: 99%

Characterization of hot deformation behavior of Al0.3CoCrFeNi high-entropy alloy and development of processing map

Patnamsetty

Ghosh

Somani

et al. 2022

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Characterization of hot deformation behavior of Al0.3CoCrFeNi high-entropy alloy and development of processing map

Patnamsetty

Ghosh

Somani

et al. 2022

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…By selecting the peak stress–stain data in Figure 5 , we established the constitutive equation between peak stress, strain rate, and deformation temperature during hot compression. The interaction relationship between the flow stress σ, the deformation temperature T , and the strain rate

of the alloy during hot deformation can usually be expressed as [ 44 , 45 , 46 , 47 , 48 ]:

where Z is the Zener–Hollomon parameter,

is the deformation rate (s −1 ), Q is the deformation activation energy of the alloy (kJ·mol −1 ), R is the gas constant (the value is 8.314 J·mol −1 ·K −1 ), σ is the true stress (MPa), T is the deformation temperature (K), and A , α , and n are temperature-independent constants.…”

Section: Resultsmentioning

confidence: 99%

Hot Deformation Behavior and Microstructure Evolution of a Novel Al-Zn-Mg-Li-Cu Alloy

Zhu

Jiang

et al. 2022

Materials

View full text Add to dashboard Cite

Lightweight structural alloys have broad application prospects in aerospace, energy, and transportation fields, and it is crucial to understand the hot deformation behavior of novel alloys for subsequent applications. The deformation behavior and microstructure evolution of a new Al-Zn-Mg-Li-Cu alloy was studied by hot compression experiments at temperatures ranging from 300 °C to 420 °C and strain rates ranging from 0.01 s−1 to 10 s−1. The as-cast Al-Zn-Mg-Li-Cu alloy is composed of an α-Al phase, an Al2Cu phase, a T phase, an η phase, and an η′ phase. The constitutive relationship between flow stress, temperature, and strain rate, represented by Zener–Hollomon parameters including Arrhenius terms, was established. Microstructure observations show that the grain size and the fraction of DRX increases with increasing deformation temperature. The grain size of DRX decreases with increasing strain rates, while the fraction of DRX first increases and then decreases. A certain amount of medium-angle grain boundaries (MAGBs) was present at both lower and higher deformation temperatures, suggesting the existence of continuous dynamic recrystallization (CDRX). The cumulative misorientation from intragranular to grain boundary proves that the CDRX mechanism of the alloy occurs through progressive subgrain rotation. This paper provides a basis for the deformation process of a new Al-Zn-Mg-Li-Cu alloy.

show abstract

“…As was also shown in Figure 1 , the volume fraction of the γ phase decreases from 11.37% to 2.67%, when going from A1 to A4. As is generally known, a multielement alloy with a close-to-equimolar composition, and with the entropy of mixing being larger than the ones for the existing alloy and the solid solutions of the alloying elements, is a microstructural characteristic of a high-entropy alloy [ 27 , 28 , 29 ]. In the present study, the reason for the decreased content of γ phase can be ascribed the high-entropy design of the alloys (i.e., by using a solution containing many alloying elements).…”

Section: Discussionmentioning

confidence: 99%

Microstructure and Magnetic Field-Induced Strain of a Ni-Mn-Ga-Co-Gd High-Entropy Alloy

Bao

et al. 2021

Materials

View full text Add to dashboard Cite

The effect of a high-entropy design on martensitic transformation and magnetic field-induced strain has been investigated in the present study for Ni-Mn-Ga-Co-Gd ferromagnetic shape-memory alloys. The purpose was to increase the martensitic transition temperature, as well as the magnetic field-induced strain, of these materials. The results show that there is a co-existence of β, γ, and martensite phases in the microstructure of the alloy samples. Additionally, the martensitic transformation temperature shows a markedly increasing trend for these high-entropy samples, with the largest value being approximately 500 °C. The morphology of the martensite exhibits typical twin characteristics of type L10. Moreover, the magnetic field-induced strain shows an increasing trend, which is caused by the driving force of the twin martensite re-arrangement strengthening.

show abstract

The effect of Al to high-temperature deformation mechanisms and processing maps of Al0.5CoCrFeMnNi high entropy alloy

Cited by 48 publications

References 63 publications

Characterization of hot deformation behavior of Al0.3CoCrFeNi high-entropy alloy and development of processing map

Characterization of hot deformation behavior of Al0.3CoCrFeNi high-entropy alloy and development of processing map

Hot Deformation Behavior and Microstructure Evolution of a Novel Al-Zn-Mg-Li-Cu Alloy

Microstructure and Magnetic Field-Induced Strain of a Ni-Mn-Ga-Co-Gd High-Entropy Alloy

Contact Info

Product

Resources

About