2019
DOI: 10.4028/www.scientific.net/kem.796.183
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The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

Abstract: Surface finish is coating layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold element in ENIG is very high cost and the black pad issue have not been resolved. Thus, by introducing an Electroless Nickel/Immersion Silver (ENImAg) as alternative surface finish hopefully can reduce the cost and offer be… Show more

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