2008
DOI: 10.1088/0953-8984/20/05/055206
|View full text |Cite
|
Sign up to set email alerts
|

The effect of deposition parameters on radiofrequency sputtered molybdenum thin films

Abstract: Employing r.f. (radiofrequency) magnetron sputtering, molybdenum thin films were fabricated on soda-lime glass substrates for use in Cu(In,Ga)Se2 based solar cells. The physical, electrical and structural properties of the films were studied as a function of two deposition parameters: argon pressure and r.f. power. The strain reversal from tensile to compressive occurs at high pressure and is found to decrease with increasing applied r.f. power. The grain sizes of films deduced from x-ray diffraction measurem… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

5
40
0
1

Year Published

2011
2011
2018
2018

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 52 publications
(46 citation statements)
references
References 15 publications
5
40
0
1
Order By: Relevance
“…The Mo thin films sputtered using ordinary d.c. [2,18] and r.f. [6] magnetron sputtering at low pressure were found to have compressive strain and showed low resistivity but our pulsed d.c. sputtered Mo films were found to have very high tensile strain with relatively high resistivity. The resistivity was reduced to a lower value suitable for solar cell applications following heat treatment.…”
Section: Accepted M Manuscriptmentioning
confidence: 64%
See 2 more Smart Citations
“…The Mo thin films sputtered using ordinary d.c. [2,18] and r.f. [6] magnetron sputtering at low pressure were found to have compressive strain and showed low resistivity but our pulsed d.c. sputtered Mo films were found to have very high tensile strain with relatively high resistivity. The resistivity was reduced to a lower value suitable for solar cell applications following heat treatment.…”
Section: Accepted M Manuscriptmentioning
confidence: 64%
“…The main concern about high tensile strain or str ess in films is that it usually leads to cracking a nd subsequent peeling off fr om the substrate [6,16] . The greater the thickness the greater will be the cracking / peeling of f force for a given level of stre ss.…”
Section: Accepted M Manuscriptmentioning
confidence: 99%
See 1 more Smart Citation
“…Under lower pressure the mean free path of the particles is longer and the films landing with higher energies tend to be more dense resulting in relatively lower resistivity values (Bourgault et al 2008). Moreover, at lower pressure there is also a chance of eliminating any presence of oxygen in the films further affecting the electrical resistivity (Khatri and Marsillac 2008).…”
Section: Resultsmentioning
confidence: 99%
“…One material that suits almost all the above requirements is molybdenum (Mo), it provides a unique back-contact material for CIGS [2] and has microstructures that can be from dense to porous depending on the sputter processing parameters such as the deposition pressure, substrate bias and temperature; this variability of the microstructure results in variations in the residual stress, electrical resistivity and film adhesion [3][4][5]. Sputtering working pressure influences the properties of sputtered atoms in two main ways [6,7].…”
Section: Introductionmentioning
confidence: 99%